| Performance analysis using air gap defected through silicon via: Impact on crosstalk and power M Chandrakar, MK Majumder IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 11 | 2022 |
| Impact of polymer liners on crosstalk induced delay of different TSV shapes M Chandrakar, MK Majumder IETE Journal of Research 70 (1), 686-699, 2024 | 3 | 2024 |
| Performance analysis of cylindrical through silicon via with interfacial crack V Kumari, M Chandrakar, MK Majumder 2023 24th International Symposium on Quality Electronic Design (ISQED), 1-6, 2023 | 2 | 2023 |
| Impact of a Tubular Dielectric Medium on Peak Noise and Crosstalk Delay in a Coaxial TSV M Chandrakar, MK Majumder Emerging Electronic Devices, Circuits and Systems: Select Proceedings of …, 2023 | | 2023 |
| Reliability Concerns in Through Silicon Via based 3D Integration: Fabrication to Packaging M Chandrakar, K Solanki, MK Majumder, R Sharma | | |
