| Overview on low temperature co-fired ceramic sensors D Jurków, T Maeder, A Dąbrowski, M Santo Zarnik, D Belavič, H Bartsch, ... Sensors and Actuators A: Physical 233, 125-146, 2015 | 91 | 2015 |
| Microstructure and Electric Properties of CaCu3Ti4O12 Multilayer Capacitors R Löhnert, H Bartsch, R Schmidt, B Capraro, J Töpfer Journal of the American Ceramic Society 98 (1), 141-147, 2015 | 76 | 2015 |
| Thick film flow sensor for biological microsystems HB De Torres, C Rensch, M Fischer, A Schober, M Hoffmann, J Müller Sensors and Actuators A: Physical 160 (1-2), 109-115, 2010 | 49 | 2010 |
| Co/Ti-substituted M-type hexagonal ferrites for high-frequency multilayer inductors S Bierlich, T Reimann, H Bartsch, J Töpfer Journal of Magnetism and Magnetic Materials 384, 1-5, 2015 | 33 | 2015 |
| A LTCC low-loss inductive proximity sensor for harsh environments H Bartsch, T Geiling, J Müller Sensors and Actuators A: Physical 175, 28-34, 2012 | 32 | 2012 |
| Integration of CaCu3Ti4O12 capacitors into LTCC multilayer modules R Löhnert, B Capraro, S Barth, H Bartsch, J Müller, J Töpfer Journal of the European Ceramic Society 35 (11), 3043-3049, 2015 | 28 | 2015 |
| LTCC-based multi-electrode arrays for 3D in vitro cell cultures H Bartsch, M Himmerlich, M Fischer, L Demkó, J Hyttinen, A Schober J. Ceram. Sci. Technol 6 (4), 315-324, 2015 | 22 | 2015 |
| LTCC based bioreactors for cell cultivation H Bartsch, T Welker, K Welker, H Witte, J Müller IOP Conference Series: Materials Science and Engineering 104 (1), 012001, 2016 | 19 | 2016 |
| A micropreconcentrator design using low temperature cofired ceramics technology for acetone detection applications A Rydosz, W Maziarz, T Pisarkiewicz, HB de Torres, J Mueller IEEE Sensors Journal 13 (5), 1889-1896, 2013 | 18 | 2013 |
| Low‐Temperature Sintered NTC Thermistor Ceramics for Thick‐Film Temperature Sensors T Reimann, J Töpfer, S Barth, H Bartsch, J Müller International Journal of Applied Ceramic Technology 10 (3), 428-434, 2013 | 17 | 2013 |
| Functionalized thick film impedance sensors for use in in vitro cell culture H Bartsch, M Baca, U Fernekorn, J Müller, A Schober, H Witte Biosensors 8 (2), 37, 2018 | 15 | 2018 |
| Silicon on ceramics—a new integration concept for silicon devices to LTCC M Fischer, HB de Torres, B Pawlowski, R Gade, S Barth, M Mach, ... Journal of microelectronics and electronic packaging 6 (1), 1-5, 2009 | 15 | 2009 |
| Microforming process for embossing of LTCC tapes H Bartsch, A Albrecht, M Hoffmann, J Müller Journal of Micromechanics and Microengineering 22 (1), 015004, 2011 | 14 | 2011 |
| Phase transformation and characterization of 3D reactive microstructures in nanoscale Al/Ni multilayers YH Sauni Camposano, SS Riegler, K Jaekel, J Schmauch, C Pauly, ... Applied Sciences 11 (19), 9304, 2021 | 13 | 2021 |
| Design and Fabrication of Transparent and Gas‐Tight Optical Windows in Low‐Temperature Co‐Fired Ceramics T Welker, T Geiling, H Bartsch, J Müller International Journal of Applied Ceramic Technology 10 (3), 405-412, 2013 | 13 | 2013 |
| Cofiring of LTCC multilayer assemblies with integrated NTC thermistor temperature sensor layers T Reimann, S Barth, B Capraro, H Bartsch, J Toepfer Ceramics International 47 (19), 27849-27853, 2021 | 12 | 2021 |
| Comprehensive (S) TEM characterization of polycrystalline GaN/AlN layers grown on LTCC substrates JJ Jiménez, JM Mánuel, H Bartsch, J Breiling, R García, HO Jacobs, ... Ceramics International 45 (7), 9114-9125, 2019 | 12 | 2019 |
| Engineering of III-Nitride semiconductors on low temperature co-fired ceramics JM Mánuel, JJ Jiménez, FM Morales, B Lacroix, AJ Santos, R García, ... Scientific reports 8 (1), 6879, 2018 | 12 | 2018 |
| Integration of High‐Frequency M‐Type Hexagonal Ferrite Inductors in LTCC Multilayer Modules S Bierlich, T Reimann, S Barth, B Capraro, H Bartsch, J Müller, J Töpfer International Journal of Applied Ceramic Technology 13 (3), 540-548, 2016 | 12 | 2016 |
| Systematic characterization of embossing processes for LTCC tapes HB de Torres, R Gade, A Albrecht, M Hoffmann Journal of microelectronics and electronic packaging 5 (4), 142-149, 2008 | 11 | 2008 |
