| Microjoining and nanojoining YN Zhou Elsevier, 2008 | 239 | 2008 |
| Interface evolution and bond strength when diffusion bonding materials with stable oxide films AA Shirzadi, H Assadi, ER Wallach Surface and Interface Analysis: An International Journal devoted to the …, 2001 | 138 | 2001 |
| Mechanical properties and processing techniques of bulk metal–organic framework glasses S Li, R Limbach, L Longley, AA Shirzadi, JC Walmsley, DN Johnstone, ... Journal of the American Chemical Society 141 (2), 1027-1034, 2018 | 107 | 2018 |
| Analytical modelling of transient liquid phase (TLP) diffusion bonding when a temperature gradient is imposed AA Shirzadi, ER Wallach Acta materialia 47 (13), 3551-3560, 1999 | 103 | 1999 |
| Joining ceramics to metals using metallic foam AA Shirzadi, Y Zhu, H Bhadeshia Materials Science and Engineering: A 496 (1-2), 501-506, 2008 | 98 | 2008 |
| Transient liquid phase diffusion bonding under a temperature gradient: modelling of the interface morphology H Assadi, AA Shirzadi, ER Wallach Acta materialia 49 (1), 31-39, 2001 | 88 | 2001 |
| New approaches for transient liquid phase diffusion bonding of aluminium based metal matrix composites AA Shirzadi, ER Wallach Materials science and technology 13 (2), 135-142, 1997 | 82 | 1997 |
| Stainless steel weld metal designed to mitigate residual stresses AA Shirzadi, H Bhadeshia, L Karlsson, PJ Withers Science and Technology of Welding and Joining 14 (6), 559-565, 2009 | 64 | 2009 |
| Design of weld fillers for mitigation of residual stresses in ferritic and austenitic steel welds RJ Moat, HJ Stone, AA Shirzadi, JA Francis, S Kundu, AF Mark, ... Science and Technology of Welding and Joining 16 (3), 279-284, 2011 | 62 | 2011 |
| Cu2O/CuO heterojunction catalysts through atmospheric pressure plasma induced defect passivation A Dey, G Chandrabose, LAO Damptey, ES Erakulan, R Thapa, S Zhuk, ... Applied Surface Science 541, 148571, 2021 | 57 | 2021 |
| Effect of Zr-Ti combined deoxidation on the microstructure and mechanical properties of high-strength low-alloy steels Y Li, XL Wan, WY Lu, AA Shirzadi, O Isayev, O Hress, KM Wu Materials Science and Engineering: A 659, 179-187, 2016 | 55 | 2016 |
| New method to diffusion bond superalloys AA Shirzadi, ER Wallach Science and technology of welding and joining 9 (1), 37-40, 2004 | 54 | 2004 |
| Effect of SiC reinforcement particles on the grain density in a magnesium-based metal–matrix composite: Modelling and experiment J Lelito, PL Zak, AA Shirzadi, AL Greer, WK Krajewski, JS Suchy, K Haberl, ... Acta Materialia 60 (6-7), 2950-2958, 2012 | 52 | 2012 |
| Structural alloys for power plants: Operational challenges and high-temperature materials A Shirzadi, S Jackson Elsevier, 2014 | 51 | 2014 |
| Temperature gradient transient liquid phase diffusion bonding: a new method for joining advanced materials AA Shirzadi, ER Wallach Science and Technology of Welding and Joining 2 (3), 89-94, 1997 | 48 | 1997 |
| Bainite orientation in plastically deformed austenite AA Shirzadi, H Abreu, L Pocock, D Klobčuar, PJ Withers, H Bhadeshia International Journal of Materials Research 100 (1), 40-45, 2009 | 39 | 2009 |
| Joining stainless steel metal foams AA Shirzadi, M Kocak, ER Wallach Science and technology of welding and joining 9 (3), 277-279, 2004 | 39 | 2004 |
| Microstructure and interfacial reactions during vacuum brazing of stainless steel to titanium using Ag-28 pct Cu alloy A Laik, AA Shirzadi, G Sharma, R Tewari, T Jayakumar, GK Dey Metallurgical and materials transactions A 46 (2), 771-782, 2015 | 38 | 2015 |
| Microstructure and interfacial reactions during active metal brazing of stainless steel to titanium A Laik, AA Shirzadi, R Tewari, A Kumar, T Jayakumar, GK Dey Metallurgical and materials transactions A 44, 2212-2225, 2013 | 37 | 2013 |
| Measurement of residual stresses in dissimilar friction stir-welded aluminium and copper plates using the contour method C Zhang, AA Shirzadi Science and Technology of Welding and Joining 23 (5), 394-399, 2018 | 33 | 2018 |
H. K. D. H. BhadeshiaProfessor of Metallurgy, Queen Mary University of London在 qmul.ac.uk 的电子邮件经过验证
