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Myung Jun Kim
Myung Jun Kim
在 skku.edu 的电子邮件经过验证 - 首页
标题
引用次数
引用次数
年份
3D printing electronic components and circuits with conductive thermoplastic filament
PF Flowers, C Reyes, S Ye, MJ Kim, BJ Wiley
Additive Manufacturing 18, 156-163, 2017
3662017
One-Dimensional Metal Nanostructures: From Colloidal Syntheses to Applications
D Huo, MJ Kim, Z Lyu, Y Shi, BJ Wiley, Y Xia
Chemical reviews 119 (15), 8972-9073, 2019
2782019
Electrochemical CO2 reduction to CO on dendritic Ag–Cu electrocatalysts prepared by electrodeposition
J Choi, MJ Kim, SH Ahn, I Choi, JH Jang, YS Ham, JJ Kim, SK Kim
Chemical Engineering Journal 299, 37-44, 2016
1652016
Electrodeposited Ag catalysts for the electrochemical reduction of CO2 to CO
YS Ham, S Choe, MJ Kim, T Lim, SK Kim, JJ Kim
Applied Catalysis B: Environmental 208, 35-43, 2017
1492017
Effect of morphology on the electrical resistivity of silver nanostructure films
IE Stewart, MJ Kim, BJ Wiley
ACS applied materials & interfaces 9 (2), 1870-1876, 2017
1172017
One-step Electrodeposition of Copper on Conductive 3D Printed Objects
MJ Kim, MA Cruz, S Ye, AL Gray, GL Smith, N Lazarus, CJ Walker, ...
Additive Manufacturing 27, 318-326, 2019
1032019
Alkaline Water Electrolysis at 25 A cm− 2 with a Microfibrous Flow‐through Electrode
F Yang, MJ Kim, M Brown, BJ Wiley
Advanced Energy Materials 10, 2001174, 2020
942020
Single-crystal electrochemistry reveals why metal nanowires grow
MJ Kim, S Alvarez, Z Chen, KA Fichthorn, BJ Wiley
Journal of the American Chemical Society 140 (44), 14740-14746, 2018
912018
Multigram synthesis of Cu‐Ag Core–shell nanowires enables the production of a highly conductive polymer filament for 3D printing electronics
MA Cruz, S Ye, MJ Kim, C Reyes, F Yang, PF Flowers, BJ Wiley
Particle & Particle Systems Characterization 35 (5), 1700385, 2018
902018
Ethylenediamine promotes Cu nanowire growth by inhibiting oxidation of Cu (111)
MJ Kim, PF Flowers, IE Stewart, S Ye, S Baek, JJ Kim, BJ Wiley
Journal of the American Chemical Society 139 (1), 277-284, 2017
802017
Impact of Surface Hydrophilicity on Electrochemical Water Splitting
BK Kim, MJ Kim, JJ Kim
ACS Applied Materials & Interfaces 13 (10), 11940-11947, 2021
792021
Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums
MJ Kim, Y Seo, HC Kim, Y Lee, S Choe, YG Kim, SK Cho, JJ Kim
Electrochimica Acta 163, 174-181, 2015
612015
Cu bottom-up filling for through silicon vias with growing surface established by the modulation of leveler and suppressor
MJ Kim, HC Kim, S Choe, JY Cho, D Lee, I Jung, WS Cho, JJ Kim
Journal of the Electrochemical Society 160 (12), D3221, 2013
602013
Modulating the Active Sites of Nickel Phosphorous by Pulse-Reverse Electrodeposition for Improving Electrochemical Water Splitting
BK Kim, MJ Kim, JJ Kim
Applied Catalysis B: Environmental 308, 121226, 2022
592022
Modulating the growth rate, aspect ratio, and yield of copper nanowires with alkylamines
MJ Kim, S Alvarez, T Yan, V Tadepalli, KA Fichthorn, BJ Wiley
Chemistry of Materials 30 (8), 2809-2818, 2018
572018
Degradation of bis (3-sulfopropyl) disulfide and its influence on copper electrodeposition for feature filling
S Choe, MJ Kim, HC Kim, SK Cho, SH Ahn, SK Kim, JJ Kim
Journal of The Electrochemical Society 160 (12), D3179, 2013
552013
Selective Electroplating for 3D‐Printed Electronics
N Lazarus, SS Bedair, SH Hawasli, MJ Kim, BJ Wiley, GL Smith
Advanced Materials Technologies 4, 1900126, 2019
482019
Characteristics of pulse-reverse electrodeposited Cu thin films: I. effects of the anodic step in the absence of an organic additive
MJ Kim, T Lim, KJ Park, SK Cho, SK Kim, JJ Kim
Journal of The Electrochemical Society 159 (9), D538, 2012
452012
The influences of iodide ion on Cu electrodeposition and TSV filling
MJ Kim, HC Kim, JJ Kim
Journal of The Electrochemical Society 163 (8), D434-D441, 2016
432016
MSA as a supporting electrolyte in copper electroplating for filling of damascene trenches and through silicon vias
SK Cho, MJ Kim, JJ Kim
Electrochemical and Solid-State Letters 14 (5), D52, 2011
432011
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