| A study on the bonding process of Cu bump/Sn/Cu bump bonding structure for 3D packaging applications B Lee, J Park, S Jeon, K Kwon, H Lee Journal of The Electrochemical Society 157 (4), H420, 2010 | 42 | 2010 |
| Laser-induced graphene on additive manufacturing parts L Jiao, ZY Chua, SK Moon, J Song, G Bi, H Zheng, B Lee, J Koo Nanomaterials 9 (1), 90, 2019 | 34 | 2019 |
| Correlations between interfacial reactions and bonding strengths of Cu/Sn/Cu pillar bump BH Kwak, MH Jeong, JW Kim, B Lee, HJ Lee, YB Park Microelectronic Engineering 89, 65-69, 2012 | 33 | 2012 |
| Employment of a bi-layer of Ni (P)/Cu as a diffusion barrier in a Cu/Sn/Cu bonding structure for three-dimensional interconnects B Lee, H Jeon, KW Kwon, HJ Lee Acta materialia 61 (18), 6736-6742, 2013 | 28 | 2013 |
| Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing JS Lee, SJ Kang, JH Shin, YJ Shin, B Lee, JM Koo, T Kim Advanced Materials 32 (21), 1908422, 2020 | 27 | 2020 |
| Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages KH Jung, KD Min, CJ Lee, BG Park, H Jeong, JM Koo, B Lee, SB Jung Applied Surface Science 495, 143487, 2019 | 26 | 2019 |
| Effects of Sn doping on the growth morphology and electrical properties of ZnO nanowires S Kim, S Na, H Jeon, S Kim, B Lee, J Yang, H Kim, HJ Lee Nanotechnology 24 (6), 065703, 2013 | 21 | 2013 |
| Effects of bonding temperature and pressure on the electrical resistance of Cu/Sn/Cu joints for 3D integration applications B Lee, J Park, J Song, K Kwon, H Lee Journal of electronic materials 40, 324-329, 2011 | 21 | 2011 |
| Evaluation of drop reliability of Sn–37Pb solder/Cu joints using a high speed lap-shear test S Jeon, JW Kim, B Lee, HJ Lee, SB Jung, S Hyun, HJ Lee Microelectronic engineering 91, 147-153, 2012 | 19 | 2012 |
| Introduction of an electroless-plated Ni diffusion barrier in Cu/Sn/Cu bonding structures for 3D integration B Lee, H Jeon, S Kim, K Kwon, JW Kim, H Lee Journal of The Electrochemical Society 159 (2), H85, 2011 | 16 | 2011 |
| Application of copper nanoparticles as die attachment for high power LED BH Lee, MZ Ng, AA Zinn, CL Gan 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-5, 2015 | 15 | 2015 |
| Evaluation of copper nanoparticles for low temperature bonded interconnections BH Lee, MZ Ng, AA Zinn, CL Gan 2015 IEEE 22nd international symposium on the physical and failure analysis …, 2015 | 15 | 2015 |
| A study on the breakdown mechanism of an electroless-plated Ni (P) diffusion barrier for Cu/Sn/Cu 3D interconnect bonding structures B Lee, H Jeon, SJ Jeon, KW Kwon, HJ Lee Journal of electronic materials 41, 109-114, 2012 | 15 | 2012 |
| Transient liquid phase (TLP) bonding using Sn/Ag multilayers for high temperature applications NS Nobeen, R Imade, BR Lee, EJR Phua, CC Wong, CL Gan, Z Chen 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 647-652, 2013 | 11 | 2013 |
| A post-treatment method to enhance the property of aerosol jet printed electric circuit on 3D printed substrate B Wang, H Zhang, JP Choi, SK Moon, B Lee, J Koo Materials 13 (24), 5602, 2020 | 7 | 2020 |
| Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnection J Kim, B Lee, JM Koo, CL Gan 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-4, 2017 | 6 | 2017 |
| Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate J Kim, B Lee, JY Lek, RI Made, B Salam, CL Gan 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 27-30, 2014 | 5 | 2014 |
| A study on the formation mechanism of ytterbium silicide for Schottky contact applications S Na, H Choi, B Lee, J Choi, Y Seo, H Kim, SH Lee, HJ Lee Surface and interface analysis 44 (11-12), 1497-1502, 2012 | 5 | 2012 |
| Highly reliable anisotropic interconnection system fabricated using Cu/Sn-Soldered microdumbbell arrays and polyimide films for application to flexible electronics HB Ha, BH Lee, N Qaiser, Y Seo, J Kim, JM Koo, B Hwang Intermetallics 144, 107535, 2022 | 4 | 2022 |
| Bump including diffusion barrier bi-layer and manufacturing method thereof H Lee, B Lee US Patent 9,209,122, 2015 | 4 | 2015 |
