| Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests T Laurila, T Mattila, V Vuorinen, J Karppinen, J Li, M Sippola, JK Kivilahti Microelectronics Reliability 47 (7), 1135-1144, 2007 | 100 | 2007 |
| Inhomogeneous deformation and microstructure evolution of Sn–Ag-based solder interconnects during thermal cycling and shear testing H Chen, J Han, J Li, M Li Microelectronics Reliability 52 (6), 1112-1120, 2012 | 76 | 2012 |
| Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling H Chen, M Mueller, TT Mattila, J Li, X Liu, KJ Wolter, M Paulasto-Kröckel Journal of Materials Research 26 (16), 2103-2116, 2011 | 70 | 2011 |
| Shock impact reliability and failure analysis of a three-axis MEMS gyroscope J Li, M Broas, J Makkonen, TT Mattila, J Hokka, M Paulasto-Krockel IEEE, 2013 | 52 | 2013 |
| Reliability of lead-free solder interconnections in thermal and power cycling tests J Li, J Karppinen, T Laurila, JK Kivilahti Components and Packaging Technologies, IEEE Transactions on 32 (2), 302-308, 2009 | 51 | 2009 |
| Wafer-level SLID bonding for MEMS encapsulation H Xu, T Suni, V Vuorinen, J Li, H Heikkinen, P Monnoyer, ... Advances in Manufacturing 1 (3), 226-235, 2013 | 49 | 2013 |
| Microstructural characterization and mechanical performance of wafer-level SLID bonded Au-Sn and Cu-Sn seal rings for MEMS encapsulation A Rautiainen, H Xu, E Österlund, J Li, V Vuorinen, M Paulasto-Kröckel Journal of Electronic Materials 44 (11), 4533-4548, 2015 | 41 | 2015 |
| On the effects of temperature on the drop reliability of electronic component boards TT Mattila, J Li, JK Kivilahti Microelectronics Reliability 52 (1), 165-179, 2012 | 39 | 2012 |
| Simulation of dynamic recrystallization in solder interconnections during thermal cycling J Li, H Xu, TT Mattila, JK Kivilahti, T Laurila, M Paulasto-Kröckel Computational Materials Science 50 (2), 690-697, 2010 | 39 | 2010 |
| Shock impact reliability characterization of a handheld product in accelerated tests and use environment J Karppinen, J Li, J Pakarinen, TT Mattila, M Paulasto-Kröckel Microelectronics Reliability 52 (1), 190-198, 2012 | 37 | 2012 |
| The Effects of Concurrent Power and Vibration Loads on the Reliability of Board-Level Interconnections in Power Electronic Assemblies JS Karppinen, J Li, M Paulasto-Krockel Device and Materials Reliability, IEEE Transactions on 13 (1), 167-176, 2013 | 29 | 2013 |
| A novel impact test system for more efficient reliability testing J Hokka, TT Mattila, J Li, J Teeri, JK Kivilahti Microelectronics Reliability 50 (8), 1125-1133, 2010 | 27 | 2010 |
| Multiscale simulation of microstructural changes in solder interconnections during thermal cycling J Li, TT Mattila, JK Kivilahti Journal of electronic materials 39 (1), 77-84, 2010 | 26 | 2010 |
| Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading J Li, M Broas, J Raami, TT Mattila, M Paulasto-Kröckel Microelectronics Reliability 54 (6), 1228-1234, 2014 | 20 | 2014 |
| Microstructural evolution and mechanical properties of Au-20wt.% Sn| Ni interconnection HQ Dong, V Vuorinen, XW Liu, T Laurila, J Li, M Paulasto-Kröckel Journal of Electronic Materials 45 (1), 566-575, 2016 | 18 | 2016 |
| Reliability assessment of a MEMS microphone under shock impact loading J Li, J Makkonen, M Broas, J Hokka, TT Mattila, M Paulasto-Krockel, ... Thermal, Mechanical and Multi-Physics Simulation and Experiments in …, 2013 | 18 | 2013 |
| Study on thermomechanical reliability of power modules and thermal grease pump-out mechanism J Li, P Myllykoski, M Paulasto-Kröckel Thermal, Mechanical and Multi-Physics Simulation and Experiments in …, 2015 | 17 | 2015 |
| Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests J Li, H Xu, J Hokka, TT Mattila, H Chen, M Paulasto-Kröckel Soldering & Surface Mount Technology 23 (3), 161-167, 2011 | 16 | 2011 |
| Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment JS Karppinen, J Li, TT Mattila, M Paulasto-Kröckel Microelectronics Reliability 50 (12), 1994-2000, 2010 | 15 | 2010 |
| Dependence of recrystallization on grain morphology of Sn-based solder interconnects under thermomechanical stress H Chen, J Li, M Li Journal of Alloys and Compounds 540, 32-35, 2012 | 14 | 2012 |
Tomi Laurila, Professor (full)Aalto University, Finland在 aalto.fi 的电子邮件经过验证
Tomi Laurila, Professor (full)Aalto University, Finland在 aalto.fi 的电子邮件经过验证
Jingshi MengUniversity of Maryland, College Park在 umd.edu 的电子邮件经过验证