| Polishing pads produced by an additive manufacturing process R Bajaj, D Redfield, M Orilall, B Fu, A Khanna, JG Fung, M Cornejo, ... | 59* | 2016 |
| Relationship between mixed and pure gas self-diffusion for ethane and ethene in ZIF-8/6FDA-DAM mixed-matrix membrane by pulsed field gradient NMR R Mueller, V Hariharan, C Zhang, R Lively, S Vasenkov Journal of Membrane Science 499, 12-19, 2016 | 52 | 2016 |
| Polishing pads produced by an additive manufacturing process R Bajaj, D Redfield, MC Orilall, FU Boyi, A Khanna, JG Fung, M Cornejo, ... US Patent 10,821,573, 2020 | 48 | 2020 |
| Polishing pads produced by an additive manufacturing process R Bajaj, D Redfield, MC Orilall, FU Boyi, A Khanna, JG Fung, M Cornejo, ... US Patent 10,384,330, 2019 | 41 | 2019 |
| Investigation of the impact of pad surface texture from different pad conditioners on the CMP performance AJ Khanna, M Yamamura, VR Kakireddy, A Chockalingam, P Jawali, ... ECS Journal of Solid State Science and Technology 9 (6), 064011, 2020 | 26 | 2020 |
| Piezo-electric end-pointing for 3d printed cmp pads V Hariharan, R Bajaj, D Redfield US Patent App. 16/259,597, 2019 | 18 | 2019 |
| High-performance pad conditioning (HPPC) arm for augmenting CMP performance AJ Khanna, VR Kakireddy, J Fung, P Jawali, M Yamamura, ... ECS Journal of Solid State Science and Technology 9 (6), 064012, 2020 | 11 | 2020 |
| One-step cost-effective growth of high-quality epitaxial ge films on si (100) using a simplified pecvd reactor J Vanjaria, V Hariharan, AC Arjunan, Y Wu, GS Tompa, H Yu Electronic Materials 2 (4), 482-494, 2021 | 6 | 2021 |
| Effect of chamber conditions and substrate type on PECVD of SiGeSn films V Hariharan, J Vanjaria, AC Arjunan, GS Tompa, H Yu Crystal Structure Theory and Applications 10 (3), 39-56, 2021 | 1 | 2021 |
| Characterization of Polish-Induced Gouges on Single Crystal Sapphire Substrates J Lee, V Hariharan, AC Arjunan, P Dumbare, K Balasundaram ECS Journal of Solid State Science and Technology 13 (5), 054005, 2024 | | 2024 |
| Formulations for advanced polishing pads S Ganapathiappan, A Vora, FU Boyi, V Hariharan, M Yamamura, ... US Patent App. 18/202,013, 2023 | | 2023 |
| Formulations for advanced polishing pads S Ganapathiappan, A Vora, FU Boyi, V Hariharan, M Yamamura, ... US Patent 11,685,014, 2023 | | 2023 |
| Surface Texture Engineering of Advanced 3D Printed CMP Pads R Kakireddy, V Hariharan, M Yamamura, A Khanna, A Chockalingam, ... Engineering Technology Conference, at Las Vegas, US 1559, 2018 | | 2018 |
| Characterization of pad surfaces for investigating conditioner performance in dielectric CMP process development M Yamamura, V Hariharan, D Redfield, R Bajaj 21st International Symposium on Chemical Mechanical Planarization, Center …, 2017 | | 2017 |
| Real-Time Process Monitoring with LK Prime and HPPC capabilities for Advanced Nodes V Hariharan, M Yamamura, I Abramson, R Kakireddy, A Chockalingam, ... 21st International Symposium on Chemical Mechanical Planarization, Center …, 2017 | | 2017 |
| High Performance Pad Conditioning (HPPC) Arm for Advanced Pad Conditioning R Kakireddy, J Fung, V Hariharan, A Khanna, M Yamamura, D Redfield, ... CMP Users Group 2017, Portland, OR, 2017 | | 2017 |
