| Measurement of the thermal performance of a custom-build single-phase immersion cooled server at various high and low temperatures for prolonged time PV Bansode, JM Shah, G Gupta, D Agonafer, H Patel, D Roe, R Tufty Journal of Electronic Packaging 142 (1), 011010, 2020 | 36 | 2020 |
| Measurement of the thermal performance of a single-phase immersion cooled server at elevated temperatures for prolonged time PV Bansode, JM Shah, G Gupta, D Agonafer, H Patel, D Roe, R Tufty International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018 | 18 | 2018 |
| Transient CFD Analysis of Dynamic Liquid-Cooling Implementation at Rack Level H Modi, P Shahi, A Sivakumar, S Saini, P Bansode, V Shalom, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 14 | 2022 |
| Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server H Modi, P Shahi, LSR Chinthaparthy, G Gupta, P Bansode, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 11 | 2022 |
| CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server P Murthy, G Gupta, J Herring, J Lamotte-Dawaghreh, KB Sivaraju, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 11 | 2022 |
| Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment A Heydari, P Shahi, V Radmard, B Eslami, U Chowdhury, A Sivakumar, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 6 | 2022 |
| Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations KB Sivaraju, P Bansode, G Gupta, J Lamotte-Dawaghreh, S Saini, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 5 | 2022 |
| Optimization of a Air-Cooled Heatsink for Immersion Cooling Application G Gupta, V Nair, SA Pundla, P Bansode, R Suthar, J Herring, ... International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 3 | 2023 |
| A Numerical Study Comparing Forced and Natural Convection in a High-Density Single-Phase Immersed Cooled Server G Gupta, V Nair, P Bansode, R Suthar, SA Pundla, J Herring, ... International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 3 | 2023 |
| Experimental Analysis of A Single-Phase Direct Liquid Cooled Server Performance at Extremely Low Temperatures for Extended Time Periods G Gupta The University of Texas at Arlington, 2018 | 2 | 2018 |
| A Numerical Study on the Influence of Mixed Convection Heat Transfer in Single-Phase Immersion Cooling S Saini, G Gupta, P Bansode, P Shahi, VS Simon, H Modi, D Agonafer, ... International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 1 | 2023 |
| Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core P Bansode, MS Ramalingam, R Suthar, R Bhandari, ... International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 1 | 2023 |
| Single-Phase Immersion Cooling Multi-Design Variable Heat Sink Optimization for Natural Convection J Herring, G Gupta, J Lamotte-Dawaghreh, P Bansode, D Agonafer International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 1 | 2023 |
| Energy Analysis of Rear Door Heat Exchangers in Data Centers With Spatial Workload Distribution VS Simon, S Karajgikar, V Mulay, SA Pundla, KB Sivaraju, G Gupta, ... International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 1 | 2023 |
| Experimental Study of Improved Chassis and Duct Redesign for Air-Cooled Server H Modi, P Shahi, VS Simon, LSR Chintaparthy, G Gupta, A Sivakumar, ... 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023 | 1 | 2023 |
| Electrochemical Additive Manufacturing Based Design of a Heat Sink for Single Phase Natural Convection Immersion Cooling Application J Lamotte-Dawaghreh, J Herring, S Pundla, R Suthar, V Nair, P Bansode, ... International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | | 2023 |
| Heat Transfer Performance of Aluminum-Foam Heat Sink Immersed in Dielectric Synthetic Fluid P Bansode, G Gupta, MS Ramalingam, V Nair, SA Pundla, S Saini, ... Available at SSRN 4402852, 0 | | |
