| 3D finite element modeling for instabilities in thin films on soft substrates F Xu, M Potier-Ferry, S Belouettar, Y Cong International Journal of Solids and Structures 51 (21-22), 3619-3632, 2014 | 79 | 2014 |
| Multiscale computational homogenization of heterogeneous shells at small strains with extensions to finite displacements and buckling Y Cong, S Nezamabadi, H Zahrouni, J Yvonnet International Journal for Numerical Methods in Engineering 104 (4), 235-259, 2015 | 43 | 2015 |
| Elastic wave harvesting in piezoelectric-defect-introduced phononic crystal microplates Z He, G Zhang, X Chen, Y Cong, S Gu, J Hong International Journal of Mechanical Sciences 239, 107892, 2023 | 31 | 2023 |
| Dynamic fracture analysis of the linearly uncoupled and coupled physical phenomena by the variable-node multiscale XFEM S Yin, N Zhang, P Liu, J Liu, T Yu, S Gu, Y Cong Engineering Fracture Mechanics 254, 107941, 2021 | 14 | 2021 |
| A non-classical couple stress based Mindlin plate finite element framework for tuning band gaps of periodic composite micro plates ZX Xia, GY Zhang, Y Cong, ST Gu Journal of Sound and Vibration 529, 116889, 2022 | 12 | 2022 |
| Elastic foundation-introduced defective phononic crystals for tunable energy harvesting G Zhang, Z He, S Wang, J Hong, Y Cong, S Gu Mechanics of Materials 191, 104909, 2024 | 10 | 2024 |
| Enhanced photoelectric properties for BiZn0. 5Zr0. 5O3 modified KNN-based lead-free ceramics J Hou, Z Dai, C Liu, S Yasui, Y Cong, S Gu Journal of Alloys and Compounds 960, 170639, 2023 | 10 | 2023 |
| A transversely isotropic magneto-electro-elastic circular Kirchhoff plate model incorporating microstructure effect W Shen, G Zhang, S Gu, Y Cong Acta Mechanica Solida Sinica, 1-13, 2021 | 10 | 2021 |
| A bi-potential contact formulation for recoverable adhesion between soft bodies based on the RCC interface model LB Hu, Y Cong, P Joli, ZQ Feng Computer Methods in Applied Mechanics and Engineering 390, 114478, 2022 | 6 | 2022 |
| Post-buckling evolution of wavy patterns in trapezoidal film/substrate bilayers F Xu, T Wang, C Fu, Y Cong, Y Huo, M Potier-Ferry International Journal of Non-Linear Mechanics 96, 46-55, 2017 | 5 | 2017 |
| Human body numerical simulation: An accurate model for a thigh subjected to a cold treatment P Michaux, B Gaume, Y Cong, O Quéméner Computers in Biology and Medicine 168, 107689, 2024 | 4 | 2024 |
| Size effects on a one-dimensional defective phononic crystal sensor Z Shu, G Zhang, Y Cong, S Gu Smart Materials and Structures 32 (11), 115029, 2023 | 4 | 2023 |
| Bandgap Analysis of Periodic Composite Microplates with Curvature-Based Flexoelectricity: A Finite Element Approach P Lai, Z He, Y Cong, S Gu, G Zhang Acta Mechanica Solida Sinica 35 (6), 996-1003, 2022 | 4 | 2022 |
| Active tuning of vibration for periodic piezoelectric micro systems: a non-local Mindlin plate finite element approach ZX Xia, Y Cong, ST Gu, ZQ Feng Mechanics of Materials 174, 104418, 2022 | 4 | 2022 |
| Simulation of instabilities in thin nanostructures by a perturbation approach Y Cong, J Yvonnet, H Zahrouni Computational Mechanics 53, 739-750, 2014 | 4 | 2014 |
| A generalized supercell model of defect-introduced phononic crystal microplates W Shen, Y Cong, S Gu, H Yin, G Zhang Acta Mechanica 235 (2), 1345-1360, 2024 | 3 | 2024 |
| Numerical simulation of the interaction between waves and pile breakwater with horizontal slotted plates J Peng, K Li, S Gu, Y Cong Ocean Engineering 287, 115777, 2023 | 3 | 2023 |
| Size-dependent parametrisation of active vibration control for periodic piezoelectric microplate coupled systems: A couple stress-based isogeometric approach P Lai, Y Cong, S Gu, G Liu Mechanics of Materials 186, 104788, 2023 | 3 | 2023 |
| A bi-potential contact formulation of orthotropic adhesion between soft bodies LB Hu, Y Cong, C Renaud, ZQ Feng Computational Mechanics 69 (4), 931-945, 2022 | 3 | 2022 |
| A rasterized plane wave expansion method for complex 2-D phononic crystals W Shen, Y Cong, S Gu, H Yin, G Zhang Mechanical Systems and Signal Processing 212, 111324, 2024 | 2 | 2024 |
Shuitao Gu重庆大学土木工程教授在 cqu.edu.cn 的电子邮件经过验证
