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Zhiqiang (Jack) Wang
Zhiqiang (Jack) Wang
Professor, Huazhong University of Science and Technology
在 ieee.org 的电子邮件经过验证
标题
引用次数
引用次数
年份
Design and performance evaluation of overcurrent protection schemes for silicon carbide (SiC) power MOSFETs
Z Wang, X Shi, Y Xue, LM Tolbert, F Wang, BJ Blalock
IEEE Transactions on Industrial Electronics 61 (10), 5570-5581, 2014
3112014
Temperature-Dependent Short-Circuit Capability of Silicon Carbide Power MOSFETs
Z Wang, X Shi, LM Tolbert, F Wang, Z Liang, D Costinett, BJ Blalock
IEEE Transactions on Power Electronics 31 (2), 1555-1566, 2016
2802016
A di/dt feedback-based active gate driver for smart switching and fast overcurrent protection of IGBT modules
Z Wang, X Shi, LM Tolbert, FF Wang, BJ Blalock
IEEE Transactions on Power Electronics 29 (7), 3720-3732, 2014
2742014
Characteristic investigation and control of a modular multilevel converter-based HVDC system under single-line-to-ground fault conditions
X Shi, Z Wang, B Liu, Y Liu, LM Tolbert, F Wang
IEEE Transactions on Power Electronics 30 (1), 408-421, 2015
1952015
A High-Temperature SiC Three-Phase AC-DC Converter Design for> 100/spl deg/C Ambient Temperature
R Wang, D Boroyevich, P Ning, Z Wang, F Wang, P Mattavelli, KDT Ngo, ...
IEEE Transactions on Power Electronics 28 (1), 555-572, 2013
1452013
A high temperature silicon carbide MOSFET power module with integrated silicon-on-insulator-based gate drive
Z Wang, X Shi, LM Tolbert, FF Wang, Z Liang, D Costinett, BJ Blalock
IEEE Transactions on Power Electronics 30 (3), 1432-1445, 2015
1302015
Active current balancing for parallel-connected silicon carbide MOSFETs
Y Xue, J Lu, Z Wang, LM Tolbert, BJ Blalock, F Wang
2013 IEEE Energy Conversion Congress and Exposition, 1563-1569, 2013
1192013
A compact planar Rogowski coil current sensor for active current balancing of parallel-connected Silicon Carbide MOSFETs
Y Xue, J Lu, Z Wang, LM Tolbert, BJ Blalock, F Wang
2014 IEEE Energy Conversion Congress and Exposition (ECCE), 4685-4690, 2014
1002014
A comparison of phase disposition and phase shift PWM strategies for modular multilevel converters
X Shi, Z Wang, LM Tolbert, F Wang
2013 IEEE Energy Conversion Congress and Exposition, 4089-4096, 2013
1002013
Electrical performance advancement in SiC power module package design with kelvin drain connection and low parasitic inductance
F Yang, Z Wang, Z Liang, F Wang
IEEE Journal of Emerging and Selected Topics in Power Electronics 7 (1), 84-98, 2018
952018
Modeling, Control Design, and Analysis of a Startup Scheme for Modular Multilevel Converters
X Shi, B Liu, Z Wang, Y Li, LM Tolbert, F Wang
IEEE Transactions on Industrial Electronics 62 (11), 7009-7024, 2015
792015
Steady-State Modeling of Modular Multilevel Converter Under Unbalanced Grid Conditions
X Shi, ZJ Wang, B Liu, Y Li, LM Tolbert, F Wang
IEEE Transactions on Power Electronics 32 (9), 7306-7324, 2017
772017
Design of a low parasitic inductance SiC power module with double-sided cooling
F Yang, Z Liang, ZJ Wang, F Wang
Applied Power Electronics Conference and Exposition (APEC), 2017 IEEE, 3057-3062, 2017
672017
Automated heatsink optimization for air-cooled power semiconductor modules
T Wu, Z Wang, B Ozpineci, M Chinthavali, S Campbell
IEEE Transactions on Power Electronics 34 (6), 5027-5031, 2018
662018
Active compensation of current unbalance in paralleled silicon carbide MOSFETs
Y Xue, J Lu, Z Wang, LM Tolbert, BJ Blalock, F Wang
2014 IEEE Applied Power Electronics Conference and Exposition-APEC 2014 …, 2014
612014
Sensitivity analysis of a wireless power transfer (WPT) system for electric vehicle application
M Chinthavali, Z Wang
IEEE Energy Conversion Congress and Exposition (ECCE), 2016
46*2016
A fast overcurrent protection scheme for IGBT modules through dynamic fault current evaluation
Z Wang, X Shi, LM Tolbert, BJ Blalock, M Chinthavali
Applied Power Electronics Conference and Exposition (APEC), 2013 Twenty …, 2013
462013
Analytical modeling of wireless power transfer (WPT) systems for electric vehicle application
M Chinthavali, Z Wang, S Campbell
IEEE Transportation Electrification Conference and Expo (ITEC), 2016
45*2016
A 50-kW air-cooled SiC inverter with 3-D printing enabled power module packaging structure and genetic algorithm optimized heatsinks
Z Wang, M Chinthavali, SL Campbell, T Wu, B Ozpineci
IEEE Transactions on Industry Applications 55 (6), 6256-6265, 2019
392019
Switching performance improvement of IGBT modules using an active gate driver
Z Wang, X Shi, LM Tolbert, BJ Blalock
Applied Power Electronics Conference and Exposition (APEC), 2013 Twenty …, 2013
392013
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