| Energy-efficient abundant-data computing: The N3XT 1,000 x MMS Aly, M Gao, G Hills, CS Lee, G Pitner, MM Shulaker, TF Wu, ... Computer 48 (12), 24-33, 2015 | 282 | 2015 |
| Hyperdimensional computing with 3D VRRAM in-memory kernels: Device-architecture co-design for energy-efficient, error-resilient language recognition H Li, TF Wu, A Rahimi, KS Li, M Rusch, CH Lin, JL Hsu, MM Sabry, ... 2016 IEEE International Electron Devices Meeting (IEDM), 16.1. 1-16.1. 4, 2016 | 142 | 2016 |
| The N3XT approach to energy-efficient abundant-data computing MMS Aly, TF Wu, A Bartolo, YH Malviya, W Hwang, G Hills, I Markov, ... Proceedings of the IEEE 107 (1), 19-48, 2018 | 130 | 2018 |
| Energy-efficient multiobjective thermal control for liquid-cooled 3-D stacked architectures MM Sabry, AK Coskun, D Atienza, TŠ Rosing, T Brunschwiler IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2011 | 82 | 2011 |
| Monolithic 3D integration: A path from concept to reality MM Shulaker, TF Wu, MM Sabry, H Wei, HSP Wong, S Mitra 2015 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2015 | 81 | 2015 |
| Resistive RAM endurance: Array-level characterization and correction techniques targeting deep learning applications A Grossi, E Vianello, MM Sabry, M Barlas, L Grenouillet, J Coignus, ... IEEE Transactions on Electron Devices 66 (3), 1281-1288, 2019 | 66 | 2019 |
| Greencool: An energy-efficient liquid cooling design technique for 3-d mpsocs via channel width modulation MM Sabry, A Sridhar, J Meng, AK Coskun, D Atienza IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2013 | 52 | 2013 |
| Opq: Compressing deep neural networks with one-shot pruning-quantization P Hu, X Peng, H Zhu, MMS Aly, J Lin Proceedings of the AAAI Conference on Artificial Intelligence 35 (9), 7780-7788, 2021 | 46 | 2021 |
| Global fan speed control considering non-ideal temperature measurements in enterprise servers J Kim, MM Sabry, D Atienza, K Vaidyanathan, K Gross 2014 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6, 2014 | 41 | 2014 |
| 14.3 A 43pJ/cycle non-volatile microcontroller with 4.7 μs shutdown/wake-up integrating 2.3-bit/cell resistive RAM and resilience techniques TF Wu, BQ Le, R Radway, A Bartolo, W Hwang, S Jeong, H Li, P Tandon, ... 2019 IEEE International Solid-State Circuits Conference-(ISSCC), 226-228, 2019 | 37* | 2019 |
| Towards thermally-aware design of 3D MPSoCs with inter-tier cooling MM Sabry, A Sridhar, D Atienza, Y Temiz, Y Leblebici, S Szczukiewicz, ... 2011 Design, Automation & Test in Europe, 1-6, 2011 | 36 | 2011 |
| Application of resistive random access memory in hardware security: A review G Rajendran, W Banerjee, A Chattopadhyay, MMS Aly Advanced Electronic Materials 7 (12), 2100536, 2021 | 33 | 2021 |
| Hardware-aware softmax approximation for deep neural networks X Geng, J Lin, B Zhao, A Kong, MMS Aly, V Chandrasekhar Computer Vision–ACCV 2018: 14th Asian Conference on Computer Vision, Perth …, 2019 | 33 | 2019 |
| Maxpoolnms: getting rid of nms bottlenecks in two-stage object detectors L Cai, B Zhao, Z Wang, J Lin, CS Foo, MS Aly, V Chandrasekhar Proceedings of the IEEE/CVF Conference on Computer Vision and Pattern …, 2019 | 32 | 2019 |
| Super-resolution and sparse view CT reconstruction G Zang, M Aly, R Idoughi, P Wonka, W Heidrich Proceedings of the European Conference on Computer Vision (ECCV), 137-153, 2018 | 30 | 2018 |
| Hierarchical thermal management policy for high-performance 3D systems with liquid cooling F Zanini, MM Sabry, D Atienza, G De Micheli IEEE Journal on Emerging and Selected Topics in Circuits and Systems 1 (2 …, 2011 | 29 | 2011 |
| Monolithic 3D integration advances and challenges: From technology to system levels MS Ebrahimi, G Hills, MM Sabry, MM Shulaker, H Wei, TF Wu, S Mitra, ... 2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S …, 2014 | 28 | 2014 |
| Fuzzy control for enforcing energy efficiency in high-performance 3D systems MM Sabry, AK Coskun, D Atienza 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 642-648, 2010 | 25 | 2010 |
| Attaining single-chip, high-performance computing through 3D systems with active cooling A Coskun, D Atienza, M Sabry, J Meng IEEE Micro 31 (4), 63-75, 2011 | 24 | 2011 |
| Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation MM Sabry, A Sridhar, D Atienza 2012 Design, Automation & Test in Europe Conference & Exhibition (DATE), 599-604, 2012 | 23 | 2012 |
David AtienzaProfessor of Electrical and Computer Engineering, EPFL在 epfl.ch 的电子邮件经过验证
