| Critically Examining the Role of Nanocatalysts in Li–O2 Batteries: Viability toward Suppression of Recharge Overpotential, Rechargeability, and Cyclability RA Wong, C Yang, A Dutta, M O, M Hong, ML Thomas, K Yamanaka, ... ACS Energy Letters 3 (3), 592-597, 2018 | 76 | 2018 |
| Growth behavior of compounds due to solid-state reactive diffusion between Cu and Al K Meguro, M O, M Kajihara Journal of Materials Science 47 (12), 4955-4964, 2012 | 43 | 2012 |
| Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects G Vakanas, M O, B Dimcic, K Vanstreels, B Vandecasteele, I De Preter, ... Microelectronic Engineering 140, 72-80, 2015 | 40 | 2015 |
| Formation of compounds and Kirkendall vacancy in the Cu–Sn system O Minho, G Vakanas, N Moelans, M Kajihara, W Zhang Microelectronic engineering 120, 133-137, 2014 | 37 | 2014 |
| Semiconductor chip package, semiconductor package including semiconductor chip package, and method of fabricating semiconductor package KIM Young-Lyong, EC Ahn, J Lee, CJ Youn, O Min-Ho, TS Yoon, CJ Yoo US Patent App. 12/141,764, 2008 | 35 | 2008 |
| Diffusion-induced recrystallization in the Cu (Pd) system at complete solid-solution temperatures S Inomata, M O, M Kajihara Journal of Materials Science 46 (8), 2410-2421, 2011 | 24 | 2011 |
| Rate-controlling process of compound growth in Cu-Clad Al wire during isothermal annealing at 483–543 K T Kizaki, M O, M Kajihara Materials Transactions, MT-M2019207, 2019 | 20 | 2019 |
| Semiconductor package embedded in substrate, system including the same and associated methods EC Ahn, MH O, JH Lee US Patent 7,888,785, 2011 | 19 | 2011 |
| Observation on Isothermal Reactive Diffusion between Solid Ni and Liquid Sn A Nakane, T Suzuki, M O, M Kajihara MATERIALS TRANSACTIONS 57 (6), 838-845, 2016 | 18 | 2016 |
| Kinetics of solid-state reactive diffusion between Co and Sn M O, Y Takamatsu, M Kajihara Materials Transactions 55 (7), 1058-1064, 2014 | 18* | 2014 |
| Kinetics of solid-state reactive diffusion between Au and Al M O, M Kajihara Materials transactions 52 (4), 677-684, 2011 | 18* | 2011 |
| Partially insulation coated metal wire for wire bonding and wire bonding method for semiconductor package using the same M O, C Park US Patent App. 11/942,575, 2008 | 17* | 2008 |
| Effect of pre-deformation on age-hardening behaviors in an Al-Mg-Cu alloy X Chen, D Kim, M O, CD Marioara, SJ Andersen, A Lervik, R Holmestad, ... Materials Science and Engineering: A 820, 141557, 2021 | 16 | 2021 |
| Kinetics of Diffusion Induced Recrystallization in the Cu (Al) System T Kizaki, M O, M Kajihara MATERIALS TRANSACTIONS, MT-M2019174, 2019 | 16 | 2019 |
| Kinetics of Reactive Diffusion in the Co/Zn System at Solid-State Temperatures Y Takamatsu, M O, M Kajihara Materials transactions 58 (4), 567-573, 2017 | 15 | 2017 |
| Enhanced mechanical properties in an Al-Mg-Cu alloy processed by the combination of cyclic deformation and aging heat treatment X Chen, M O, E Kobayashi Journal of Alloys and Compounds 911, 165070, 2022 | 14 | 2022 |
| Formation of intermetallic compounds and microstructure evolution due to isothermal reactive diffusion at the interface between solid Co and liquid Sn N Odashima, M O, M Kajihara Journal of Electronic Materials 49 (2), 1568-1576, 2020 | 14 | 2020 |
| Influence of substrate microstructure on hydroxyapatite coating and corrosion behavior of coated MgZn alloys DN Pham, S Hiromoto, M O, E Kobayashi Surface and Coatings Technology 421, 127414, 2021 | 13 | 2021 |
| Experimental Observation on Solid-State Reactive Diffusion between Sn–Ag Alloys and Ni M Nakayama, M O, M Kajihara Materials transactions 58 (4), 561-566, 2017 | 13 | 2017 |
| Semiconductor package using chip-embedded interposer substrate MH O, J Lee, EC Ahn, PW Kim US Patent 7,626,254, 2009 | 12* | 2009 |
