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HU Xinlan
HU Xinlan
在 hust.edu.cn 的电子邮件经过验证
标题
引用次数
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年份
The Effect of Electric-Thermal-Vibration Stress Coupling on the Reliability of Sn-Ag-Cu Solder Joints
X Hu, L He, H Chen, Y Lv, H Gao, J Liu
Journal of Electronic Materials 51, 284-294, 2022
152022
Progress and Challenges in Electromechanical Coupling of Radio Telescopes
Y Yan, S Xue, X Hu, P Lian, Q Xu, N Wang, W Zhao, Y Wu, B Duan, ...
International Journal of Antennas and Propagation 2022, 2022
32022
Accurate Data Match and Call Method for the Thermal Compensation Database of the Reflector Antenna
Y Yan, S Xue, X Hu, P Lian, Y Wang, L Li, Q Xu, N Wang, W Zhao, ...
Research in Astronomy and Astrophysics 22 (5), 055011, 2022
22022
Weighted distribution constraint based prediction of available interval of coaxial-to-microstrip flexible interconnection
J Tian, J Liu, S Xue, L Zhang, C Zhou, S Liu, Y Wang, G Leng, Y Zou, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022
22022
Mechanistic insights into waterjet-guided laser grooving of silicon: Impact of ablation dynamics, oxide formation, and thermal stress
X Hu, T Shi, Y Long, Y Huang, G Zhang
Journal of Applied Physics 136 (23), 2024
2024
Optimal Sensor Placement for Health Monitoring of Large Space Structures in Harsh Environment: A GA-EfI Approach
P Xu, Y Wang, X Xu, Y Teng, D Ge, G Leng, Y Wu, X Wang, X Hu, C Wang
Proceedings of the Eighth Asia International Symposium on Mechatronics, 60-72, 2022
2022
Electromechanical Coupling and Application of High-Frequency Communication Antenna Channel Capacity
Y Yan, Y Wang, B Han, X Hu, P Lian, Z Wang, K Yu, M Wang, Y Wu, ...
Electronics 11 (12), 1857, 2022
2022
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