| Deep learning modeling strategy for material science: from natural materials to metamaterials W Li, P Chen, B Xiong, G Liu, S Dou, Y Zhan, Z Zhu, T Chu, Y Li, W Ma Journal of Physics: Materials 5 (1), 014003, 2022 | 16 | 2022 |
| An Integrative 3D printing method for rapid additive manufacturing of a capacitive force sensor GD Liu, CH Wang, ZL Jia, KX Wang Journal of Micromechanics and Microengineering 31 (6), 065005, 2021 | 15 | 2021 |
| Silicon on insulator pressure sensor based on a thermostable electrode for high temperature applications GD Liu, WP Cui, H Hu, FS Zhang, YX Zhang, CC Gao, YL Hao Micro & Nano Letters 10 (10), 496-499, 2015 | 13 | 2015 |
| A rapid design and fabrication method for a capacitive accelerometer based on machine learning and 3D printing techniques G Liu, C Wang, Z Jia, K Wang, W Ma, Z Li IEEE Sensors Journal 21 (16), 17695-17702, 2021 | 11 | 2021 |
| High temperature pressure sensor using Cu-Sn wafer level bonding GD Liu, CC Gao, YX Zhang, YL Hao 2015 IEEE SENSORS, 1-4, 2015 | 8 | 2015 |
| A monolithic integration multifunctional MEMS sensor based on cavity SOI wafer Y Zhang, C Yang, F Meng, G Liu, C Gao, Y Hao SENSORS, 2014 IEEE, 1952-1955, 2014 | 7 | 2014 |
| Topologically-optimized on-chip metamaterials for ultra-short-range light focusing and mode-size conversion W Ma, M Hou, R Luo, B Xiong, N Liu, G Liu, T Chu Nanophotonics 12 (6), 1189-1197, 2023 | 5 | 2023 |
| Laser-assisted sintering of silver nanoparticle paste for bonding of silicon to DBC for high-temperature electronics packaging GD Liu, C Wang, J Swingler IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020 | 5 | 2020 |
| High temperature pressure sensor using a thermostable electrode GD Liu, WP Cui, H Hu, FS Zhang, YX Zhang, CC Gao, YL Hao 10th IEEE International Conference on Nano/Micro Engineered and Molecular …, 2015 | 5 | 2015 |
| A rapid fabrication approach for the capacitive accelerometer based on 3D printing and a silver particle-free ink G Liu, W Yang, C Wang, J Rao Journal of Materials Science: Materials in Electronics 32 (13), 17901-17910, 2021 | 4 | 2021 |
| Design and simulation of corrugated diaphragm applied to the MEMS fiber optic pressure sensor Y Gui, Y Zhang, G Liu, Y Hao, C Gao 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and …, 2016 | 3 | 2016 |
| A wafer-level pressure calibration method for integrated accelerometer and pressure sensor in TPMS application Y Zhang, F Meng, G Liu, C Gao, Y Hao 2015 Transducers-2015 18th International Conference on Solid-State Sensors …, 2015 | 3 | 2015 |
| Silicon-silicon anodic bonding process with embedded glass WP Cui, GD Liu, FS Zhang, H Hu, CC Gao, YL Hao 10th IEEE International Conference on Nano/Micro Engineered and Molecular …, 2015 | 3 | 2015 |
| Highly sensitive seesaw capacitive pressure sensor based on SOI wafer YLH CC Yang, Q Zhao, CC Gao, GD Liu, YX Zhang, WP Cui Electronics letters 50, 376-377, 2014 | 3 | 2014 |
| Finite element modeling and analysis method for predicting and optimizing the warpage of construction before flip chip bonding in System-on-Wafer process flow Y Duan, G Liu, W Wang, Q Deng, J Li, R Cao, C Wang Microelectronics Reliability 151, 115260, 2023 | 2 | 2023 |
| Single-step-etched ultra-compact metamaterial grating coupler enabled by a hierarchical inverse design approach Q Wang, R Luo, N Liu, M Hou, B Xiong, G Liu, W Ma Science China Physics, Mechanics & Astronomy 67 (2), 224211, 2024 | | 2024 |
| Ultra-Compact Silicon-on-Chip Photonic Devices Based on Inverse Design M Hou, Q Wang, R Luo, G Liu, N Liu, W Ma 2023 Asia Communications and Photonics Conference/2023 International …, 2023 | | 2023 |
| 800 Gbps Integrated Silicon Photonics Receiver Chip Based on Cascaded Mach-Zehnder Interferometer (MZI) Lattice Filters R Luo, M Hou, N Liu, Q Wang, X Ruan, G Liu, W Ma 2023 Asia Communications and Photonics Conference/2023 International …, 2023 | | 2023 |
| 800G Receiver Integrated Chip based on Tunable Etched Diffraction Grating N Liu, R Luo, M Hou, Q Wang, G Liu, W Ma 2023 Asia Communications and Photonics Conference/2023 International …, 2023 | | 2023 |
| Embedded Wafer-level Microfluidic Cooling Designs for The System on Wafer Packaging J Li, G Liu, W Wang, R Cao, C Wang, L Liu 2023 24th International Conference on Electronic Packaging Technology (ICEPT …, 2023 | | 2023 |
