| Design, modeling, analysis and testing of a novel piezo-actuated XY compliant mechanism for large workspace nano-positioning WL Zhu, Z Zhu, Y Shi, X Wang, K Guan, BF Ju Smart Materials and Structures 25 (11), 115033, 2016 | 83 | 2016 |
| Texturing of metallic surfaces for superhydrophobicity by water jet guided laser micro-machining Y Shi, Z Jiang, J Cao, KF Ehmann Applied Surface Science 500, 144286, 2020 | 56 | 2020 |
| Effective forming strategy for double-sided incremental forming considering in-plane curvature and tool direction N Moser, Z Zhang, H Ren, H Zhang, Y Shi, EE Ndip-Agbor, B Lu, J Chen, ... CIRP Annals 65 (1), 265-268, 2016 | 54 | 2016 |
| Springback reduction by annealing for incremental sheet forming Z Zhang, H Zhang, Y Shi, N Moser, H Ren, KF Ehmann, J Cao Procedia Manufacturing 5, 696-706, 2016 | 49 | 2016 |
| Multi-scale modeling of mechanical behavior of cured woven textile composites accounting for the influence of yarn angle variation B Liang, W Zhang, JS Fenner, J Gao, Y Shi, D Zeng, X Su, WK Liu, J Cao Composites Part A: Applied Science and Manufacturing 124, 105460, 2019 | 44 | 2019 |
| A sequential sampling strategy to improve the global fidelity of metamodels in multi-level system design Y Liu, Y Shi, Q Zhou, R Xiu Structural and Multidisciplinary Optimization 53, 1295-1313, 2016 | 38 | 2016 |
| A novel piezoelectrically actuated 2-DoF compliant micro/nano-positioning stage with multi-level amplification WL Zhu, Z Zhu, Y Shi, X Chen, Y He, KF Ehmann, BF Ju Review of Scientific Instruments 87 (10), 2016 | 33 | 2016 |
| Experimental study of water jet incremental micro-forming with supporting dies Y Shi, W Zhang, J Cao, KF Ehmann Journal of Materials Processing Technology 268, 117-131, 2019 | 22 | 2019 |
| Enabling hybrid bonding on Intel process A Elsherbini, K Jun, R Vreeland, W Brezinski, HK Niazi, Y Shi, Q Yu, ... 2021 IEEE International Electron Devices Meeting (IEDM), 34.3. 1-34.3. 4, 2021 | 21 | 2021 |
| Enabling next generation 3D heterogeneous integration architectures on intel process A Elsherbini, K Jun, S Liff, T Talukdar, J Bielefeld, W Li, R Vreeland, ... 2022 International Electron Devices Meeting (IEDM), 27.3. 1-27.3. 4, 2022 | 17 | 2022 |
| An experimental and numerical study of dieless water jet incremental microforming Y Shi, W Zhang, J Cao, KF Ehmann Journal of Manufacturing Science and Engineering 141 (4), 041008, 2019 | 10 | 2019 |
| Surface hardening of metals at room temperature by nanoparticle-laden cavitating waterjets X He, M Song, Y Du, Y Shi, BA Johnson, KF Ehmann, YW Chung, ... Journal of Materials Processing Technology 275, 116316, 2020 | 8 | 2020 |
| Metamodel-based direction guidance system optimization for improving efficiency of aircraft emergency evacuation Y Liu, Y Shi, T Jiang, JZ Liu, WJ Wang Computers & Industrial Engineering 91, 302-314, 2016 | 8 | 2016 |
| A comparative study of relevant vector machine and support vector machine in uncertainty analysis Y Shi, F Xiong, R Xiu, Y Liu 2013 International Conference on Quality, Reliability, Risk, Maintenance …, 2013 | 8 | 2013 |
| Generation of surfaces with isotropic and anisotropic wetting properties by curved water jet-guided laser micromachining Y Shi, J Cao, KF Ehmann Journal of Micro-and Nano-Manufacturing 8 (4), 041001, 2020 | 6 | 2020 |
| Dieless water jet incremental micro-forming Y Shi, J Cao, KF Ehmann International Manufacturing Science and Engineering Conference 51388 …, 2018 | 6 | 2018 |
| Response of high-pressure micro water jets to static and dynamic nonuniform electric fields Y Shi, J Cao, KF Ehmann Journal of Micro-and Nano-Manufacturing 6 (2), 021006, 2018 | 4 | 2018 |
| High-throughput, in situ imaging of multi-layer powder-blown directed energy deposition with angled nozzle S Webster, M Giovannini, Y Shi, N Martinez-Prieto, K Fezzaa, T Sun, ... Review of Scientific Instruments 93 (2), 2022 | 2 | 2022 |
| Incremental micro-forming of stainless steel foil by high-speed water jet Y Shi, J Cao, W Zhang, KF Ehmann Proceedings of the International Symposium on Flexible Automation 2018 …, 2018 | 1 | 2018 |
| Die crack mitigation in multi-chip composite ic structures A Elsherbini, W Li, BJ Krishnatreya, T TALUKDAR, B Zhang, Y Shi, ... US Patent App. 17/891,666, 2024 | | 2024 |
Kornel EhmannNorthwestern University在 northwestern.edu 的电子邮件经过验证
