| Solder joint reliability under realistic service conditions P Borgesen, S Hamasha, M Obaidat, V Raghavan, X Dai, M Meilunas, ... Microelectronics Reliability 53 (9-11), 1587-1591, 2013 | 59 | 2013 |
| Simulation based alternatives for overall process improvement at the cardiac catheterization lab V Venkatadri, VA Raghavan, V Kesavakumaran, SS Lam, K Srihari Simulation Modelling Practice and Theory 19 (7), 1544-1557, 2011 | 42 | 2011 |
| Lean transformation in a high mix low volume electronics assembly environment VA Raghavan, S Yoon, K Srihari International journal of lean six sigma, 2014 | 28 | 2014 |
| On the complete breakdown of miner’s rule for lead free BGA joints L Yang, V Raghavan, B Roggeman, L Yin, P Borgesen Proc. SMTA Int 2, 689-696, 2009 | 26 | 2009 |
| A genetic algorithm based heuristic for dynamic lot sizing problem with returns and hybrid products P Koken, VA Raghavan, SW Yoon Computers & Industrial Engineering 119, 453-464, 2018 | 25 | 2018 |
| Reengineering the cardiac catheterization lab processes: a lean approach V Raghavan, V Venkatadri, V Kesavakumaran, S Wang, M Khasawneh, ... Journal of Healthcare Engineering 1 (1), 45-65, 2010 | 25 | 2010 |
| Effects of pre-stressing on solder joint failure by pad cratering V Raghavan, B Roggeman, M Meilunas, P Borgesen 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 22 | 2010 |
| Effects of ‘Latent Damage’on pad cratering: Reduction in life and a potential change in failure mode VA Raghavan, B Roggeman, M Meilunas, P Borgesen Microelectronics Reliability 53 (2), 303-313, 2013 | 18 | 2013 |
| A modified Genetic Algorithm approach to minimize total weighted tardiness with stochastic rework and reprocessing times VA Raghavan, SW Yoon, K Srihari Computers & Industrial Engineering 123, 42-53, 2018 | 15 | 2018 |
| Heuristic algorithms to minimize total weighted tardiness with stochastic rework and reprocessing times VA Raghavan, SW Yoon, K Srihari Journal of Manufacturing Systems 37, 233-242, 2015 | 10 | 2015 |
| Joint level test methods for solder pad cratering investigations BD Roggeman, V Raghavan, P Borgesen Journal of Electronic Packaging 133 (3), 031007, 2011 | 10 | 2011 |
| A Methodology for Assessing the Adoption Rates of an Organization's Lean Transformation VA Raghavan, SS Lam, K Srihari, S Ramakrishnan, MV Testani IIE Annual Conference. Proceedings, 998, 2013 | 3 | 2013 |
| Pad cratering: Development of a test protocol and quantification of the effects of ‘latent damage’at the joint level and assembly level VA Raghavan State University of New York at Binghamton, 2010 | 3 | 2010 |
| Pad cratering: Development of a test protocol and quantificationof the effects of ‘latent damage’at thejoint level and assembly level VA Raghavan State University of New York at Binghamton, 2010 | 3 | 2010 |
| Implementation of web-based manufacturing process aid in the electronic assembly shop floor D Li, V Raghavan, SW Yoon Journal of Intelligent Manufacturing 26 (6), 1281-1290, 2015 | 1 | 2015 |
| An Operations Research Framework for Strategic Decision Making in New Technology Introduction VA Raghavan, K Nyat, R Khare, A Modali IIE Annual Conference. Proceedings, 1504-1509, 2018 | | 2018 |
| A Framework for Job Shop Scheduling with Stochastic Rework and Reprocessing in Electronics Manufacturing VA Raghavan State University of New York at Binghamton, Thomas J. Watson School of …, 2013 | | 2013 |
| A Job Shop Scheduling Model with Rework Time in Electronics Manufacturing VA Raghavan, SW Yoon, K Srihari IIE Annual Conference. Proceedings, 2995, 2013 | | 2013 |
