关注
Seungmin Lee
Seungmin Lee
Samsung Electronics Co.
在 g.skku.edu 的电子邮件经过验证
标题
引用次数
引用次数
年份
Highly stackable 3D capacitor-less DRAM for a high-performance hybrid memory
S Lee, B Choi
IEEE Electron Device Letters 43 (12), 2089-2092, 2022
52022
High-Density 3-D NAND Cell Array Design With Hybrid Bonding
S Lee, J Lim, JH Kim, S Cho, YK Lee, B Choi
IEEE Transactions on Electron Devices, 2023
22023
Three-dimensional semiconductor memory devices
S Lee, J Kim
US Patent US11973025B2, 2022
2022
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