| Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold (ENIG) interface D Goyal, T Lane, P Kinzie, C Panichas, KM Chong, O Villalobos 52nd Electronic Components and Technology Conference 2002.(Cat. No …, 2002 | 88 | 2002 |
| 3D microelectronic packaging: from fundamentals to applications Y Li, D Goyal Springer, 2017 | 79 | 2017 |
| Electro Optical Terahertz Pulse Reflectometry—an innovative fault isolation tool Y Cai, Z Wang, R Dias, D Goyal 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 61 | 2010 |
| Detection and characterization of defects in microelectronic packages and boards by means of high-resolution X-ray computed tomography (CT) M Pacheco, D Goyal 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1263-1268, 2011 | 38 | 2011 |
| Advanced Fault Isolation and Failure Analysis Techniques for Future Package Technologies. M Pacheco, Z Wang, L Skoglund, Y Liu, A Medina, A Raman, R Dias, ... Intel Technology Journal 9 (4), 2005 | 38 | 2005 |
| Effect of Zn doping in CuO octahedral crystals towards structural, optical, and gas sensing properties CP Goyal, D Goyal, S K. Rajan, NS Ramgir, Y Shimura, M Navaneethan, ... Crystals 10 (3), 188, 2020 | 35 | 2020 |
| X-ray computed tomography for non-destructive failure analysis in microelectronics M Pacheco, D Goyal 2010 IEEE International Reliability Physics Symposium, 252-258, 2010 | 35 | 2010 |
| A review of failure analysis methods for advanced 3D microelectronic packages Y Li, PKM Srinath, D Goyal Journal of Electronic Materials 45, 116-124, 2016 | 33 | 2016 |
| HRCT evaluation of microtia: A retrospective study AR Patil, A Bhalla, P Gupta, D Goyal, S Vishnubhatla, A Ramavat, ... Indian Journal of Radiology and Imaging 22 (03), 188-194, 2012 | 25 | 2012 |
| Lead-free solder joint void evolution during multiple subsequent high-temperature reflows Y Li, JS Moore, B Pathangey, RC Dias, D Goyal IEEE Transactions on Device and Materials Reliability 12 (2), 494-500, 2012 | 21 | 2012 |
| Effect of package design and layout on BGA solder joint reliability of an organic C4 package B Chandran, D Goyal, J Thomas 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat …, 2000 | 20 | 2000 |
| Inline measurement of molding material thickness using terahertz reflectance S Liu, NZ Ghosh, Z Wang, D Goyal, S Gokhale, J Zhang US Patent 9,508,610, 2016 | 19 | 2016 |
| Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens S Liu, Z Wang, NZ Ghosh, D Goyal US Patent 9,746,428, 2017 | 18 | 2017 |
| Multi-objective structural optimization of wind turbine tower and foundation systems using Isight: A process automation and design exploration software JC Nicholson, JS Arora, D Goyal, JM Tinjum 10th World Congress on Structural and Multidisciplinary Optimization, 19-24, 2013 | 18 | 2013 |
| Role of growth temperature in photovoltaic absorber CuSbSe2 deposition through e-beam evaporation D Goyal, CP Goyal, H Ikeda, P Malar Materials science in semiconductor processing 108, 104874, 2020 | 17 | 2020 |
| New developments in high-resolution X-ray computed tomography for non-destructive defect detection in next generation package technologies M Pacheco, D Goyal International Symposium for Testing and Failure Analysis 30910, 30-35, 2008 | 15 | 2008 |
| Introduction to 3D microelectronic packaging Y Li, D Goyal 3D Microelectronic Packaging: From Architectures to Applications, 1-16, 2021 | 13 | 2021 |
| Innovations in fault isolation methods for 3d packages with 10x improvement in accuracy M Xie, T Begala, K Kijkanjanapaiboon, D Goyal 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 755-765, 2016 | 13 | 2016 |
| Key parameters for fast Ni dissolution during electromigration of Sn0. 7Cu solder joint P Liu, A Overson, D Goyal 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 99-105, 2015 | 13 | 2015 |
| Non destructive failure analysis of 3D electronic packages using both electro optical terahertz pulse reflectometry and 3D X-ray computed tomography Y Li, Y Cai, M Pacheco, RC Dias, D Goyal International Symposium for Testing and Failure Analysis 39791, 95-99, 2012 | 12 | 2012 |
