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Minh Hoang Nguyen
Minh Hoang Nguyen
Postdoctoral Research Fellow, University of Michigan
在 umich.edu 的电子邮件经过验证 - 首页
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引用次数
引用次数
年份
Effect of automated fiber placement (AFP) manufacturing signature on mechanical performance of composite structures
MH Nguyen, AA Vijayachandran, P Davidson, D Call, D Lee, AM Waas
Composite Structures 228, 111335, 2019
892019
A novel mode-dependent and probabilistic semi-discrete damage model for progressive failure analysis of composite laminates-Part I: Meshing strategy and mixed-mode law
MH Nguyen, AM Waas
Composites Part C: Open Access 3, 100073, 2020
322020
Particle-toughened interlayers enhance mechanical response of composite laminates
MH Nguyen, P Davidson, AM Waas
Composites Science and Technology 182, 107761, 2019
302019
Modeling delamination migration in composite laminates using an enhanced semi-discrete damage model (eSD2M)
MH Nguyen, AM Waas
International Journal of Solids and Structures 236, 111323, 2022
252022
Experimental and numerical study on the tensile failure behavior of toughened-interlayer composite laminates with automated fiber placement (AFP) induced gap and overlap defects
MH Nguyen, P Davidson, AM Waas
International Journal of Material Forming 14, 105-119, 2021
242021
Use of a neural network constitutive model for the size-dependent effects of curing on the deformation response and failure of fiber-reinforced polymer matrix composites
MH Nguyen, RJ D’Mello, AM Waas
Archive of Applied Mechanics 93 (1), 369-387, 2023
152023
Effect of automated fiber placement (AFP) manufacturing signature on mechanical performance
MH Nguyen, AA Vijayachandran, P Davidson, D Call, D Lee, AM Waas
AIAA scitech 2019 forum, 0516, 2019
142019
Detailed experimental and numerical investigation of single-edge notched tensile cross-ply laminates
MH Nguyen, AM Waas
Composite Structures 279, 114731, 2022
102022
High-fidelity progressive failure analysis of the open hole tensile (OHT) behavior of composite laminates with a novel semi-discrete method
MH Nguyen, AM Waas
AIAA Scitech 2021 Forum, 0312, 2021
82021
Particle toughened interfaces enhance mechanical response of composites
MH Nguyen, AA Vijayachandran, P Davidson, AM Waas
AIAA Scitech 2019 forum, 1041, 2019
82019
Efficient and Validated Framework for Probabilistic Progressive Failure Analysis of Composite Laminates
MH Nguyen, AM Waas
AIAA Journal 60 (9), 5500-5520, 2022
72022
Numerical study on the effects of ply stacking and interlayer toughening on the failure modes and response of OHT laminates
MH Nguyen, AM Waas
Composites Science and Technology 234, 109935, 2023
62023
Influence of automated fiber placement (AFP) manufacturing signature on the mechanical performance of a composite
MH Nguyen, P Davidson, AM Waas
AIAA Scitech 2020 Forum, 0473, 2020
62020
Effect of automated fiber placement (AFP) manufacturing induced imperfections on composite performance
M NGUYEN, A VIJAYACHANDRAN, P DAVIDSON, D CALL, D LEE, ...
Proceedings of the American Society for Composites—Thirty-third Technical …, 2018
32018
A multi-mechanism framework for cure-informed probabilistic progressive failure analysis of composite structures
MH Nguyen, RJ D'Mello, AM Waas
AIAA SCITECH 2023 Forum, 0593, 2023
12023
High-fidelity and computationally efficient digital tool for probabilistic progressive failure analysis of composite laminates: Experiments and virtual testing
MH Nguyen, AM Waas
AIAA SCITECH 2022 Forum, 0663, 2022
12022
OHT and OHC predictions of laminated tape composites using a high-fidelity and efficient semi-discrete computational framework
MH Nguyen, VS Iyer, R Dmello, A Waas
AIAA SCITECH 2024 Forum, 1885, 2024
2024
Computational modeling of damage in notched and unnotched composite laminates using a semi-discrete method
AM Waas, MH Nguyen
Modeling Damage Fatigue and Failure of Composite Materials, 443-465, 2024
2024
Effect of stacking sequence and interlayer toughening in+/− 45 laminates
MH Nguyen, AM Waas
Journal of the Mechanics and Physics of Solids 181, 105458, 2023
2023
Systems and methods for semi-discrete modeling of progressive damage and failure in composite laminate materials
MH Nguyen, AM Waas
US Patent App. 17/987,411, 2023
2023
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