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Xiaoyang Ji
Xiaoyang Ji
University of Illinois at Urbana-Champaign, University of Bristol
在 bristol.ac.uk 的电子邮件经过验证
标题
引用次数
引用次数
年份
Good Solid‐State Electrolytes Have Low, Glass‐Like Thermal Conductivity
Z Cheng, B Zahiri, X Ji, C Chen, D Chalise, PV Braun, DG Cahill
Small 17 (28), 2101693, 2021
362021
Sodium insertion cathode material Na0. 67 [Ni0. 4Co0. 2Mn0. 4] O2 with excellent electrochemical properties
X Sun, XY Ji, HY Xu, CY Zhang, Y Shao, Y Zang, CH Chen
Electrochimica Acta 208, 142-147, 2016
342016
A new gridding cyanoferrate anode material for lithium and sodium ion batteries: Ti0. 75Fe0. 25 [Fe (CN) 6] 0.96· 1.9 H2O with excellent electrochemical properties
X Sun, XY Ji, YT Zhou, Y Shao, Y Zang, ZY Wen, CH Chen
Journal of Power Sources 314, 35-38, 2016
332016
Thermal visualization of buried interfaces enabled by ratio signal and steady-state heating of time-domain thermoreflectance
Z Cheng, F Mu, X Ji, T You, W Xu, T Suga, X Ou, DG Cahill, S Graham
ACS Applied Materials & Interfaces 13 (27), 31843-31851, 2021
262021
Anisotropic thermal and electrical conductivities of individual polyacrylonitrile-based carbon fibers
X Ji, S Matsuo, NR Sottos, DG Cahill
Carbon 197, 1-9, 2022
182022
Topological metal MoP nanowire for interconnect
HJ Han, S Kumar, G Jin, X Ji, JL Hart, DJ Hynek, QP Sam, V Hasse, ...
Advanced Materials 35 (13), 2208965, 2023
162023
Battery absorbs heat during charging uncovered by ultra-sensitive thermometry
Z Cheng, X Ji, DG Cahill
Journal of Power Sources 518, 230762, 2022
9*2022
Thermal conductivity mapping of oxidized SiC/SiC composites by time‐domain thermoreflectance with heterodyne detection
X Ji, Z Cheng, EK Pek, DG Cahill
Journal of the American Ceramic Society 104 (9), 4773-4781, 2021
92021
Lithium trapping, hydrogen content, and solid electrolyte interphase growth in electrodeposited silicon anodes by ion beam analysis
X Ji, NJ Fritz, H Jeong, P Lu, JW Lin, PV Braun, DG Cahill
Journal of Power Sources 614, 235039, 2024
2024
Interfacial reaction boosts thermal conductance of room-temperature integrated semiconductor interfaces stable up to 1100 C
Z Cheng, X Ji, Z Huang, Y Ohno, K Inoue, Y Nagai, Y Sakaida, H Uratani, ...
arXiv preprint arXiv:2404.09120, 2024
2024
Correction to “Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance”
Z Cheng, F Mu, X Ji, T You, W Xu, T Suga, X Ou, DG Cahill, S Graham
ACS Applied Materials & Interfaces 14 (19), 22678-22678, 2022
2022
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