| Failure analysis of the electromagnetic relay contacts B Wan, G Fu, Y Li, Y Zhao, M Jia Engineering Failure Analysis 59, 304-313, 2016 | 18 | 2016 |
| SLD constant-stress ADT data analysis based on time series method L Wang, X Li, T Jiang, B Wan 2009 8th International Conference on Reliability, Maintainability and Safety …, 2009 | 18 | 2009 |
| A high-efficiency IGBT health status assessment method based on data driven Z Zhang, G Fu, B Wan, M Jiang, Y Li IEEE Transactions On Electron Devices 68 (1), 168-174, 2020 | 17 | 2020 |
| Research on IGBT bonding wires crack propagation at the macro and micro scales J Luo, S Guan, B Wan, M Jiang, G Fu IEEE Access 9, 106270-106282, 2021 | 13 | 2021 |
| Life prediction methodology of system-in-package based on physics of failure G Fu, Y Su, W Guo, B Wan, Z Zhang, Y Wang Microelectronics Reliability 88, 173-178, 2018 | 13 | 2018 |
| Failure analysis of solder layer in power transistor M Jiang, G Fu, B Wan, P Xue, Y Qiu, Y Li Soldering & Surface Mount Technology 30 (1), 49-56, 2018 | 13 | 2018 |
| Research on sintering process and thermal conductivity of hybrid nanosilver solder paste based on molecular dynamics simulation Z Zhang, G Fu, B Wan, Y Su, M Jiang Microelectronics Reliability 126, 114203, 2021 | 12 | 2021 |
| An improved cost-based method of risk priority number Y Zhao, G Fu, B Wan, C Pei Proceedings of the IEEE 2012 Prognostics and System Health Management …, 2012 | 11 | 2012 |
| Fatigue reliability design for metal dual inline packages under random vibration based on response surface method Y Su, G Fu, B Wan, T Yu, W Zhou, X Wang Microelectronics Reliability 100, 113404, 2019 | 10 | 2019 |
| Step-stress ADT data estimation based on time series method L Wang, X Li, B Wan, T Jiang 2010 Proceedings-Annual Reliability and Maintainability Symposium (RAMS), 1-6, 2010 | 10 | 2010 |
| PRNU estimation of linear CMOS image sensors that allows nonuniform illumination Y Wang, B Wan, G Fu, Y Su IEEE Transactions on Instrumentation and Measurement 70, 1-11, 2021 | 9 | 2021 |
| Phase-field modelling of lead-free solder joint void growth under thermal-electrical coupled stress Y Li, G Fu, B Wan, X Yan, W Zhang, W Li Journal of Electronic Materials 51, 259-272, 2022 | 8 | 2022 |
| Damage based PoF model of solder joints under temperature cycling and electric coupling condition J Yuan, S Zhang, B Wan, G Fu, M Jiang Microelectronics Reliability 114, 113814, 2020 | 8 | 2020 |
| Reliability evaluation of multi-mechanism failure for semiconductor devices using physics-of-failure technique and maximum entropy principle B Wan, Y Wang, Y Su, G Fu IEEE Access 8, 188154-188170, 2020 | 8 | 2020 |
| Method to predict lifetime of IGBT under power cycling based-on fast electro-thermo-mechanical model M Jiang, G Fu, H Leng, B Wan, Y Cheng 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 8 | 2018 |
| An improved risk priority number method based on AHP Y Zhao, G Fu, B Wan 2013 Proceedings Annual Reliability and Maintainability Symposium (RAMS), 1-7, 2013 | 7 | 2013 |
| Storage life prediction of electromagnetic relay based on pof analysis B Wan, G Fu, N Li, Y Zhao, L Wang 2013 Proceedings Annual Reliability and Maintainability Symposium (RAMS), 1-6, 2013 | 7 | 2013 |
| Failure analysis of sac305 ball grid array solder joint at extremely cryogenic temperature Y Li, G Fu, B Wan, M Jiang, W Zhang, X Yan Applied Sciences 10 (6), 1951, 2020 | 6 | 2020 |
| A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3. 0Ag0. 5Cu solder joints Y Li, G Fu, B Wan, Z Wu, X Yan, W Zhang Soldering & Surface Mount Technology 34 (3), 162-173, 2022 | 5 | 2022 |
| Failure analysis of hall-effect sensors in brushless DC starter/generator Y Su, G Fu, B Wan, D Zhang, X Ma Engineering Failure Analysis 103, 226-237, 2019 | 5 | 2019 |
