| Mechanical properties of silicones for MEMS F Schneider, T Fellner, J Wilde, U Wallrabe Journal of Micromechanics and Microengineering 18 (6), 065008, 2008 | 523 | 2008 |
| Applying Anand model to represent the viscoplastic deformation behavior of solder alloys GZ Wang, ZN Cheng, K Becker, J Wilde J. Electron. Packag. 123 (3), 247-253, 2001 | 408 | 2001 |
| Rate dependent constitutive relations based on Anand model for 92.5 Pb5Sn2. 5Ag solder J Wilde, K Becker, M Thoben, W Blum, T Jupitz, G Wang, ZN Cheng IEEE transactions on Advanced Packaging 23 (3), 408-414, 2000 | 161 | 2000 |
| Viscoplastic Anand model for solder alloys and its application ZN Cheng, GZ Wang, L Chen, J Wilde, K Becker Soldering & Surface Mount Technology 12 (2), 31-36, 2000 | 154 | 2000 |
| Failure mechanisms of sintered silver interconnections for power electronic applications T Herboth, M Guenther, A Fix, J Wilde 2013 IEEE 63rd electronic components and technology conference, 1621-1627, 2013 | 97 | 2013 |
| Microstructural changes of lead‐free solder joints during long‐term ageing, thermal cycling and vibration fatigue AR Fix, W Nüchter, J Wilde Soldering & Surface Mount Technology 20 (1), 13-21, 2008 | 85 | 2008 |
| Microstructural and electrical properties of different-sized aluminum-alloyed contacts and their layer system on silicon surfaces J Krause, R Woehl, M Rauer, C Schmiga, J Wilde, D Biro Solar Energy Materials and Solar Cells 95 (8), 2151-2160, 2011 | 81 | 2011 |
| A temperature-gradient-induced failure mechanism in metallization under fast thermal cycling T Smorodin, J Wilde, P Alpern, M Stecher IEEE Transactions on device and materials reliability 8 (3), 590-599, 2008 | 77 | 2008 |
| Assembly and packaging technologies for high-temperature and high-power GaN devices AA Bajwa, Y Qin, R Reiner, R Quay, J Wilde IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015 | 73 | 2015 |
| Moisture-resistant properties of SiNx films prepared by PECVD H Lin, L Xu, X Chen, X Wang, M Sheng, F Stubhan, KH Merkel, J Wilde Thin Solid Films 333 (1-2), 71-76, 1998 | 73 | 1998 |
| Capacitive strain gauges on flexible polymer substrates for wireless, intelligent systems R Zeiser, T Fellner, J Wilde Journal of Sensors and Sensor Systems 3 (1), 77-86, 2014 | 50 | 2014 |
| Impact of screen printing silver paste components on the space charge region recombination losses of industrial silicon solar cells R Hoenig, A Kalio, J Sigwarth, F Clement, M Glatthaar, J Wilde, D Biro Solar Energy Materials and Solar Cells 106, 7-10, 2012 | 49 | 2012 |
| The nature of screen printed front side silver contacts-results of the project MikroSol R Hoenig, M Duerrschnabel, W van Mierlo, Z Aabdin, J Bernhard, ... Energy Procedia 43, 27-36, 2013 | 46 | 2013 |
| New measurement method for the investigation of space charge region recombination losses induced by the metallization of silicon solar cells R Hoenig, M Glatthaar, F Clement, J Greulich, J Wilde, D Biro Energy Procedia 8, 694-699, 2011 | 43 | 2011 |
| Reliability modeling of Sn–Ag transient liquid phase die-bonds for high-power SiC devices AA Bajwa, J Wilde Microelectronics Reliability 60, 116-125, 2016 | 42 | 2016 |
| Development of lead-free silver ink for front contact metallization A Kalio, M Leibinger, A Filipovic, K Krüger, M Glatthaar, J Wilde Solar energy materials and solar cells 106, 51-54, 2012 | 41 | 2012 |
| Assessment of thermo-mechanical stresses in low temperature joining technology T Herboth, C Früh, M Günther, J Wilde 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and …, 2012 | 40 | 2012 |
| Development, characterisation and 1000 suns outdoor tests of GaAs monolithic interconnected module (MIM) receivers R Loeckenhoff, F Dimroth, E Oliva, A Ohm, J Wilde, D Faiman, S Biryukov, ... Progress in Photovoltaics: Research and applications 16 (2), 101-112, 2008 | 40 | 2008 |
| Design optimization of an eddy current sensor using the finite-elements method J Wilde, Y Lai Microelectronics Reliability 43 (3), 345-349, 2003 | 35 | 2003 |
| The influence of package-induced stresses on moulded Hall sensors S Fischer, H Beyer, R Janke, J Wilde Microsystem technologies 12, 69-74, 2005 | 32 | 2005 |
