| Simulation of surface deformation control during selective laser melting of AlSi10Mg powder using an external magnetic field L Chen, H Li, S Liu, S Shen, T Zhang, Y Huang, G Zhang, Y Zhang, B He, ... AIP Advances 9 (4), 2019 | 33 | 2019 |
| A miniature robotic turtle with target tracking and wireless charging systems based on IPMCs Q Sun, J Han, H Li, S Liu, S Shen, Y Zhang, J Sheng IEEE Access 8, 187156-187164, 2020 | 26 | 2020 |
| Digital twin-driven intelligent production line for automotive MEMS pressure sensors Q Zhang, S Shen, H Li, W Cao, W Tang, J Jiang, M Deng, Y Zhang, B Gu, ... Advanced Engineering Informatics 54, 101779, 2022 | 25 | 2022 |
| Thermal fatigue analysis of gold wire bonding solder joints in MEMS pressure sensors by thermal cycling tests Y Zhang, K Wu, H Li, S Shen, W Cao, F Li, J Han Microelectronics Reliability 139, 114829, 2022 | 20 | 2022 |
| Investigation of potting-adhesive-induced thermal stress in MEMS pressure sensor Y Zhang, B Li, H Li, S Shen, F Li, W Ni, W Cao Sensors 21 (6), 2011, 2021 | 17 | 2021 |
| Investigation of acoustic injection on the MPU6050 accelerometer Y Zhang, H Li, S Shen, G Zhang, Y Yang, Z Liu, Q Xie, C Gao, P Zhang, ... Sensors 19 (14), 3083, 2019 | 6 | 2019 |
| Instrumentation, measurement, and signal processing in electroencephalography-based brain–computer interfaces: situations and prospects Z Xue, Y Zhang, H Li, H Chen, S Shen, H Du IEEE Transactions on Instrumentation and Measurement, 2024 | 5 | 2024 |
| Inkjet printing of triethylene glycol monomethyl ether (TEGMME)-based ink droplet on oxygen plasma treated PDMS substrate for flexible circuit Y Zhang, B Gu, W Tang, Z Xue, S Shen, H Li Surfaces and Interfaces 48, 104356, 2024 | 4 | 2024 |
| Flexible LC Sensor Array for Wireless Multi-zone Pressure Monitoring Y Zhang, W Tang, H Chen, H Li, Z Xue, S Shen IEEE Sensors Journal, 2023 | 4 | 2023 |
| Porous Microneedle Array Electrode Using Interstitial Fluid as Conductive Fillers for Biosafe and Long-Term Biopotential Monitoring Z Xue, Y Zhang, Y Zheng, S Shen, H Li IEEE Transactions on Electron Devices, 2025 | | 2025 |
| Fatigue life evaluation of gold wire bonding solder joints in MEMS pressure sensors Y Zhang, K Wu, S Shen, Q Zhang, W Cao, S Liu Journal of Micromechanics and Microengineering 33 (2), 025002, 2022 | | 2022 |
