| Effect of different thermal cycling profiles on the mechanical behavior of SAC305 lead free solder M Al Ahsan, SMK Hasan, A Fahim, JC Suhling, P Lall 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 28 | 2020 |
| Fatigue analysis and fracture toughness of graphene reinforced carbon fibre polymer composites MS Tareq, B Jony, S Zainuddin, M Al Ahsan, MV Hosur Fatigue & Fracture of Engineering Materials & Structures 44 (2), 461-474, 2021 | 26 | 2021 |
| Mechanical Property and Microstructure Evolution in SAC and Lead Free Solders Exposed to Various Thermal Cycling Profiles SMK Hasan, A Fahim, M Al Ahsan, JC Suhling, P Lall 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 868-876, 2021 | 14 | 2021 |
| Mechanical Property Evolution in SAC+Bi Lead Free Solders Subjected to Various Thermal Exposures MA Ahsan, SMK Hasan, A Fahim, JC Suhling, P Lall 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 12 | 2021 |
| Flexural fatigue and fracture toughness behavior of nanoclay reinforced carbon fiber epoxy composites MSH Tareq, S Zainuddin, MV Hosur, B Jony, MA Ahsan, S Jeelani Journal of Composite Materials 54 (29), 4645-4660, 2020 | 11 | 2020 |
| Creep and Microstructure Evolutions in SAC305 Lead Free Solder Subjected to Different Thermal Exposure Profiles SMK Hasan, M Al Ahsan, JC Suhling, P Lall 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2191-2200, 2022 | 8 | 2022 |
| Quasi-static compression characterization of binary nanoclay/graphene reinforced carbon/epoxy composites subjected to seawater conditioning M Al Ahsan, M Hosur, SH Tareq, SMK Hasan Materials Research Express 7 (1), 015033, 2020 | 8 | 2020 |
| Mechanical Property Evolution in SAC+Bi Lead-Free Solders Subjected to Various Thermal Exposure Profiles MA Ahsan, SMK Hasan, MA Haq, JC Suhling, P Lall 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), pp …, 2022 | 7 | 2022 |
| The Effect of Bismuth Content on Mechanical Property Evolution of SAC+Bi Lead Free Solders Subjected to Long Term Thermal Exposures MA Ahsan, SMK Hasan, JC Suhling, P Lall 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2022 | 6 | 2022 |
| Comparison of thermal cycling induced mechanical property evolutions in bulk solder and solder joints SMK Hasan, A Fahim, M Al Ahsan, JC Suhling, P Lall 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 5 | 2021 |
| Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures SMK Hasan, A Fahim, M Al Ahsan, JC Suhling, S Hamasha, P Lall International Electronic Packaging Technical Conference and Exhibition 85505 …, 2021 | 2 | 2021 |
| Effect of Salt Fog Spray and Ultraviolet Exposure on the Fracture Surface Morphology of Fiber Reinforced Polymer Composites M Al Ahsan, T Rahman, A Ludwick, H Aglan Microscopy and Microanalysis, 1-3, 2020 | 2 | 2020 |
| Analysis of elastic field in functionally graded material beams with square cross-section M Agrawal, M Al Ahsan, MA Ali AIP Conference Proceedings 1919 (1), 2017 | 2 | 2017 |
| Evolution of the Creep Response of SAC+ Bi Lead-Free Solders Subjected to Various Thermal Exposures M Al Ahsan, SMK Hasan, JC Suhling, P Lall 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2054-2061, 2023 | 1 | 2023 |
| The Effects of Thermal Exposure on the Creep Behavior of SAC+ Bi Lead-Free Solders M Al Ahsan, SMK Hasan, JC Suhling, P Lall 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023 | 1 | 2023 |
| Thermo-mechanical analysis of seawater-conditioned carbon/polymer composites reinforced with nanoclay/graphene nanoparticles MA Ahsan, MSH Tareq, M Hosur, A Tcherbi-Narteh MRS Advances 6, 369-377, 2021 | 1 | 2021 |
| Mechanical Characterization and Modeling of iSAC Lead-Free Solder GR Mazumder, S Chakraborty, MA Maruf, M Al Ahsan, JC Suhling, P Lall 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1973-1980, 2024 | | 2024 |
| Correlation of Mechanical and Microstructural Evolutions in Lead Free Solders Subjected to Various Thermal Exposures M Al Ahsan, SMK Hasan, S Chakraborty, JC Suhling, P Lall 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1460-1467, 2024 | | 2024 |
| Evolution of the Creep Behavior for SAC305 Lead Free Solder Exposed to Various Thermal Profiles SMK Hasan, M Al Ahsan, JC Suhling, P Lall 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | | 2022 |
Jeffrey C. SuhlingAuburn University, Department of Mechanical Engineering在 auburn.edu 的电子邮件经过验证
