| On fundamental principles for thermal-aware design on periodic real-time multi-core systems S Sha, AS Bankar, X Yang, W Wen, G Quan ACM Transactions on Design Automation of Electronic Systems (TODAES) 25 (2 …, 2020 | 8 | 2020 |
| Thermal aware lifetime reliability optimization for automotive distributed computing applications AS Bankar, S Sha, V Chaturvedi, G Quan 2020 IEEE 38th International Conference on Computer Design (ICCD), 498-505, 2020 | 4 | 2020 |
| Generative AI-Based Data Analysis for Evaluation of Variations in XPS Characteristics of MoS2 S Shendokar, N Raykar, A Bankar, S Aravamudhan 2023 IEEE 3rd International Conference on Smart Technologies for Power …, 2024 | 1 | 2024 |
| Thermal Aware System-Wide Reliability Optimization for Automotive Distributed Computing Applications AS Bankar, S Sha, J Bhimani, V Chaturvedi, G Quan IEEE Transactions on Vehicular Technology 71 (10), 10442-10457, 2022 | 1 | 2022 |
| Thermal Aware Design Automation of the Electronic Control System for Autonomous Vehicles A Bankar Florida International University, 2022 | | 2022 |
| Heart Sound Signal Analysis and Its Implementation in VHDL AS Patil, JP Gawande, A Bankar Innovations in Electronics and Communication Engineering: Proceedings of the …, 2019 | | 2019 |
| Interstage Pipeline VLSI Architecture for 2-D DWT AS Bankar, BS Shaha, PK Kadbe, V Baramati International Journal of Engineering Research & Technology (IJERT) 2 (5 …, 2013 | | 2013 |
gang quanFlorida International University在 fiu.edu 的电子邮件经过验证
