| MEMS for wireless communications:‘from RF-MEMS components to RF-MEMS-SiP’ HAC Tilmans, W De Raedt, E Beyne Journal of Micromechanics and Microengineering 13 (4), S139, 2003 | 306 | 2003 |
| Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules H Tilmans, E Beyne, H Jansen, W De Raedt US Patent 6,876,056, 2005 | 257* | 2005 |
| Accurate multibias equivalent-circuit extraction for GaN HEMTs G Crupi, D Xiao, DMMP Schreurs, E Limiti, A Caddemi, W De Raedt, ... IEEE transactions on microwave theory and techniques 54 (10), 3616-3622, 2006 | 189 | 2006 |
| Analytical model of the DC actuation of electrostatic MEMS devices with distributed dielectric charging and nonplanar electrodes X Rottenberg, I De Wolf, BKJC Nauwelaers, W De Raedt, HAC Tilmans Journal of Microelectromechanical Systems 16 (5), 1243-1253, 2007 | 165 | 2007 |
| Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits G Carchon, K Vaesen, S Brebels, W De Raedt, E Beyne, B Nauwelaers IEEE Transactions on Components and Packaging Technologies 24 (3), 510-519, 2001 | 147 | 2001 |
| Large-scale wearable data reveal digital phenotypes for daily-life stress detection E Smets, E Rios Velazquez, G Schiavone, I Chakroun, E D’Hondt, ... NPJ digital medicine 1 (1), 67, 2018 | 142 | 2018 |
| Distributed dielectric charging and its impact on RF MEMS devices X Rottenberg, B Nauwelaers, W De Raedt, HAC Tilmans 34th European Microwave Conference, 2004. 1, 77-80, 2004 | 112 | 2004 |
| Into the wild: the challenges of physiological stress detection in laboratory and ambulatory settings E Smets, W De Raedt, C Van Hoof IEEE journal of biomedical and health informatics 23 (2), 463-473, 2018 | 111 | 2018 |
| Accurate modeling of high-Q spiral inductors in thin-film multilayer technology for wireless telecommunication applications P Pieters, K Vaesen, S Brebels, SF Mahmoud, W De Raedt, E Beyne, ... IEEE Transactions on Microwave Theory and Techniques 49 (4), 589-599, 2001 | 108 | 2001 |
| Quality assessment of computational techniques and software tools for planar-antenna analysis A Vasylchenko, Y Schols, W De Raedt, GAE Vandenbosch IEEE Antennas and Propagation Magazine 51 (1), 23-38, 2009 | 105 | 2009 |
| Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab HAC Tilmans, H Ziad, H Jansen, O Di Monaco, A Jourdain, W De Raedt, ... International Electron Devices Meeting. Technical Digest (Cat. No. 01CH37224 …, 2001 | 105 | 2001 |
| 3D integration technology: Status and application development P Ramm, A Klumpp, J Weber, N Lietaer, M Taklo, W De Raedt, T Fritzsch, ... 2010 Proceedings of ESSCIRC, 9-16, 2010 | 100 | 2010 |
| Wafer-level packaging technology for high-Q on-chip inductors and transmission lines GJ Carchon, W De Raedt, E Beyne IEEE Transactions on Microwave Theory and Techniques 52 (4), 1244-1251, 2004 | 100 | 2004 |
| Tunable stop-band filter at Q-band based on RF-MEMS metamaterials I Gil, F Martın, X Rottenberg, W De Raedt Electronics Letters 43 (21), 1153-1154, 2007 | 99 | 2007 |
| Chip-package codesign of a low-power 5-GHz RF front end S Donnay, P Pieters, K Vaesen, W Diels, P Wambacq, W De Raedt, ... Proceedings of the IEEE 88 (10), 1583-1597, 2000 | 93 | 2000 |
| Two new measurement methods for explicit determination of complex permittivity C Wan, B Nauwelaers, W De Raedt, M Van Rossum IEEE transactions on microwave theory and techniques 46 (11), 1614-1619, 1998 | 88 | 1998 |
| SOP integration and codesign of antennas S Brebels, J Ryckaert, B Come, S Donnay, W De Raedt, E Beyne, ... IEEE Transactions on Advanced Packaging 27 (2), 341-351, 2004 | 86 | 2004 |
| Comparison of machine learning techniques for psychophysiological stress detection E Smets, P Casale, U Großekathöfer, B Lamichhane, W De Raedt, ... Pervasive Computing Paradigms for Mental Health: 5th International …, 2016 | 81 | 2016 |
| 50-to-67GHz ESD-protected power amplifiers in digital 45nm LP CMOS K Raczkowski, S Thijs, W De Raedt, B Nauwelaers, P Wambacq 2009 IEEE International Solid-State Circuits Conference-Digest of Technical …, 2009 | 80 | 2009 |
| Single-package integration of RF blocks for a 5 GHz WLAN application W Diels, K Vaesen, P Wambacq, S Donnay, W De Raedt, M Engels, ... IEEE Transactions on Advanced Packaging 24 (3), 384-391, 2001 | 79 | 2001 |
Eric BeyneSenior Fellow, VP R&D在 imec.be 的电子邮件经过验证
