关注
Chia-Pang Kuo
Chia-Pang Kuo
3DIC & BEOL Interconnect R&D Engineer, tsmc
在 tsmc.com 的电子邮件经过验证 - 首页
标题
引用次数
引用次数
年份
Lithium storage in reduced graphene oxides
SL Kuo, WR Liu, CP Kuo, NL Wu, HC Wu
Journal of Power Sources 244, 552-556, 2013
782013
Selective deposition of metal barrier in damascene processes
CP Kuo, YL Lee, CY Shen
US Patent 11,398,406, 2022
132022
Electrode of a solar cell substrate
TC Hsu, KC Lin, CP Kuo, HC Lee
US Patent App. 29/537,959, 2019
132019
Solar cell with rear side multi-layer anti-reflection coating
SH Feng, CP Kuo
US Patent App. 15/000,037, 2016
92016
Gradient atomic layer deposition
CP Kuo, YL Lee
US Patent 10,672,652, 2020
42020
Diffusion barrier for semiconductor device and method
CP Kuo, HY Shih, WH Chen, CL Tsai, YL Lee, CH Weng, CC Lin, HW Su, ...
US Patent 11,676,898, 2023
22023
Solar cell
TC Hsu, KC Lin, CP Kuo, HC Lee
US Patent 9,923,102, 2018
12018
Solar cell and fabrication method thereof
CP Kuo, SH Feng, CM Lin
US Patent App. 14/987,671, 2016
12016
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION
S Chin, C Chi, H Peng, J Huang, Y Lee, K Chen, C Kuo, Y Liu
US Patent App. 18/786,849, 2024
2024
Selective deposition of metal barrier in damascene processes
CP Kuo, YL Lee, CY Shen
US Patent App. 18/766,300, 2024
2024
Interconnection structure and methods of forming the same
CP Kuo, JL Lan, CH Yang, MY Gao, CF Lin
US Patent App. 18/209,655, 2024
2024
Aluminum structures
CP Kuo, S Yang, YG Lin, T Hsi-Chen, CF Lin, HW Su
US Patent App. 18/179,676, 2024
2024
Selective deposition of metal barrier in damascene processes
CP Kuo, YL Lee, CY Shen
US Patent 12,068,194, 2024
2024
Selective deposition of metal barrier in damascene processes and the structures formed thereof
CP Kuo, YL Lee, CY Shen
US Patent 11,837,500, 2023
2023
Via for semiconductor device and method
CP Kuo, CY Chang, MH Hsieh, WH Chan, YL Lee, CC Huang, CC Lin, ...
US Patent App. 18/358,803, 2023
2023
Via for semiconductor device and method
CP Kuo, CY Chang, MH Hsieh, WH Chan, YL Lee, CC Huang, CC Lin, ...
US Patent 11,810,857, 2023
2023
Semiconductor devices and methods of formation
SC Chin, CC Chi, HY Peng, JJ Huang, YL Lee, KC Chen, CP Kuo, YM Liu
US Patent App. 17/655,510, 2023
2023
Semiconductor processing tool and method for passivation layer formation and removal
CP Kuo, YM Liu, SC Chin, CC Chi, CH Weng
US Patent App. 17/653,780, 2023
2023
Interconnect structure of semiconductor device
YM Liu, CP Kuo, CC Huang, CY Chang, YL Lee, CC Lin, HW Su, MH Tsai
US Patent 11,527,476, 2022
2022
Diffusion Barrier for Semiconductor Device and Method
CP Kuo, HY Shih, WH Chen, CL Tsai, YL Lee, CH Weng, CC Lin, HW Su, ...
US Patent App. 17/815,026, 2022
2022
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