| UNIPIC code for simulations of high power microwave devices J Wang, D Zhang, C Liu, Y Li, Y Wang, H Wang, H Qiao, X Li Physics of Plasmas 16 (3), 2009 | 218 | 2009 |
| Three-dimensional parallel UNIPIC-3D code for simulations of high-power microwave devices J Wang, Z Chen, Y Wang, D Zhang, C Liu, Y Li, H Wang, H Qiao, M Fu, ... Physics of Plasmas 17 (7), 2010 | 104 | 2010 |
| Secondary electron emission of graphene-coated copper M Cao, XS Zhang, WH Liu, HG Wang, YD Li Diamond and Related Materials 73, 199-203, 2017 | 42 | 2017 |
| Simulation investigation of multipactor in metal components for space application with an improved secondary emission model Y Li, WZ Cui, HG Wang Physics of Plasmas 22 (5), 2015 | 37 | 2015 |
| A note on the discovery of absorption features in 1E 1207.4-5209 X Ren-Xin, W Hong-Guang, Q Guo-Jun Chinese physics letters 20 (2), 314, 2003 | 37 | 2003 |
| Multipactor threshold calculation of coaxial transmission lines in microwave applications with nonstationary statistical theory S Lin, H Wang, Y Li, C Liu, N Zhang, W Cui, A Neuber Physics of Plasmas 22 (8), 2015 | 31 | 2015 |
| Three-dimensional simulation method of multipactor in microwave components for high-power space application Y Li, WZ Cui, N Zhang, XB Wang, HG Wang, YD Li, JF Zhang Chinese Physics B 23 (4), 048402, 2014 | 29 | 2014 |
| A photoionization model considering lifetime of high excited states of N2 for PIC-MCC simulations of positive streamers in air M Jiang, Y Li, H Wang, P Zhong, C Liu Physics of Plasmas 25 (1), 2018 | 27 | 2018 |
| 2D particle-in-cell simulation of the entire process of surface flashover on insulator in vacuum H Wang, J Zhang, Y Li, S Lin, P Zhong, C Liu Physics of Plasmas 25 (4), 2018 | 26 | 2018 |
| Accurate numerical method for multipactor analysis in microwave devices JW You, HG Wang, JF Zhang, SR Tan, TJ Cui IEEE Transactions on Electron Devices 61 (5), 1546-1552, 2014 | 26 | 2014 |
| Highly efficient and adaptive numerical scheme to analyze multipactor in waveguide devices JW You, HG Wang, JF Zhang, Y Li, WZ Cui, TJ Cui IEEE Transactions on Electron Devices 62 (4), 1327-1333, 2015 | 24 | 2015 |
| 3D PIC-MCC simulation of corona discharge in needle-plate electrode with external circuit M Jiang, LI Yongdong, H Wang, W Ding, C Liu Plasma Sources Science and Technology 29 (1), 015020, 2020 | 23 | 2020 |
| 3D PIC-MCC simulations of positive streamers in air gaps M Jiang, Y Li, H Wang, C Liu Physics of Plasmas 24 (10), 2017 | 23 | 2017 |
| Accurate numerical analysis of nonlinearities caused by multipactor in microwave devices JW You, HG Wang, JF Zhang, SR Tan, TJ Cui IEEE Microwave and Wireless Components Letters 24 (11), 730-732, 2014 | 20 | 2014 |
| Dark topological valley Hall edge solitons B Ren, H Wang, VO Kompanets, YV Kartashov, Y Li, Y Zhang Nanophotonics 10 (13), 3559-3566, 2021 | 19 | 2021 |
| A segmented polynomial model to evaluate passive intermodulation products from low-order pim measurements L Zhang, H Wang, S He, H Wei, Y Li, C Liu IEEE Microwave and Wireless Components Letters 29 (1), 14-16, 2018 | 19 | 2018 |
| Effect of secondary emission yield and initial charge of dielectric material on multipactor in parallel-plate dielectric-loaded waveguide Y Zhai, H Wang, L Zhang, S Lin, Y Li, Y Li IEEE Transactions on Electron Devices 66 (12), 5333-5338, 2019 | 18 | 2019 |
| Numerical simulation and analysis of passive intermodulation caused by multipaction L Zhang, Y Li, S Lin, H Wang, C Liu, J Li, Z Xu Physics of Plasmas 25 (8), 2018 | 18 | 2018 |
| A fast single particle Monte-Carlo method of computing the breakdown threshold of multipactor in microwave device L Yongdong, Y Yangjiao, L Shu, W Hong-Guang, L Chun-Liang Acta Physica Sinica 63, 047902, 2014 | 16 | 2014 |
| The conformal TDFIT-PIC method using a new extraction of conformal information (ECI) technique JW You, HG Wang, JF Zhang, WZ Cui, TJ Cui IEEE Transactions on Plasma Science 41 (11), 3099-3108, 2013 | 16 | 2013 |
