| Mechanical reliability assessment of a flexible Package fabricated using laser-assisted bonding XL Le, XB Le, Y Hwangbo, J Joo, GM Choi, YS Eom, KS Choi, SH Choa Micromachines 14 (3), 601, 2023 | 4 | 2023 |
| A comprehensive numerical analysis for preventing cracks in 2.5 D glass interposer XB Le, SH Choa Journal of Mechanical Science and Technology, 1-11, 2024 | 2 | 2024 |
| Electromechanical Properties of Monolayer Sn-Dichalcogenides LX Bach, V Van Thanh, H Van Bao, D Van Truong, NT Hung Modern Mechanics and Applications: Select Proceedings of ICOMMA 2020, 1113-1119, 2022 | 1 | 2022 |
| Turning Electronic and Optical Properties of Monolayer Janus Sn-Dichalcogenides By Biaxial Strain V Van Thanh, NT Dung, LX Bach, D Van Truong, NT Hung Modern Mechanics and Applications: Select Proceedings of ICOMMA 2020, 981-989, 2022 | 1 | 2022 |
| Assessment of the Risk of Crack Formation at a Hybrid Bonding Interface Using Numerical Analysis XB Le, SH Choa Micromachines 15 (11), 1332, 2024 | | 2024 |
| Electromechanical properties of monolayer Sn-dichalcogenides VVT Le Xuan Bach, H Van Bao, N Do Van Truong, T Hung | | 2020 |
| Strain effects on electronic and optical properties of monolayer Mo-dichalcogenides V Van Thanh, NT Dung, NDV Le Xuan Bach | | 2020 |
Do Van TruongHanoi University of Science and Technology在 hust.edu.vn 的电子邮件经过验证
