Cooling of high heat flux miniaturized electronic devices using thermal ground plane: An overview BL Rakshith, LG Asirvatham, AA Angeline, S Manova, JR Bose, JPS Raj, ... Renewable and Sustainable Energy Reviews 170, 112956, 2022 | 22 | 2022 |
Thermal management strategies and power ratings of electric vehicle motors JAPS Raj, LG Asirvatham, AA Angeline, S Manova, BL Rakshith, JR Bose, ... Renewable and Sustainable Energy Reviews 189, 113874, 2024 | 10 | 2024 |
The analysis of ball-milled aluminium alloy 7068 metal powders KJ Joshua, P Sherjin, JPS Raj SSRG International Journal of Mechanical Engineering (SSRG-IJME) 4 (8), 2017 | 6 | 2017 |
Cooling of power electronic devices using rectangular flat heat pipes with externally and internally cooled condenser regions BL Rakshith, LG Asirvatham, AA Angeline, JAPS Raj, JR Bose, ... Applied Thermal Engineering 236, 121474, 2024 | 2 | 2024 |
Experimental investigation on the heat transfer performance of flat heat pipe embedded with internally cooled condenser BL Rakshith, LG Asirvatham, AA Angeline, JPS Raj, JR Bose, ... International Journal of Heat and Mass Transfer, 125728, 2024 | | 2024 |