Preparation of TiO2 layers on cp‐Ti and Ti6Al4V by thermal and anodic oxidation and by sol‐gel coating techniques and their characterization D Velten, V Biehl, F Aubertin, B Valeske, W Possart, J Breme Journal of Biomedical Materials Research: An Official Journal of The Society …, 2002 | 441 | 2002 |
Induction thermography: principle, applications and first steps towards standardisation U Netzelmann, G Walle, S Lugin, A Ehlen, S Bessert, B Valeske Quantitative InfraRed Thermography Journal 13 (2), 170-181, 2016 | 85 | 2016 |
Network structure in epoxy aluminium bonds after mechanical treatment C Bockenheimer, B Valeske, W Possart International Journal of Adhesion and Adhesives 22 (5), 349-356, 2002 | 85 | 2002 |
Methods for the quality assessment of adhesive bonded CFRP structures-a resumé B Ehrhart, B Valeske, CE Muller, C Bockenheimer 2nd International Symposium on NDT in Aerospace 2010, 2010 | 77 | 2010 |
Development of a laser shock adhesion test for the assessment of weak adhesive bonded CFRP structures B Ehrhart, R Ecault, F Touchard, M Boustie, L Berthe, C Bockenheimer, ... International Journal of Adhesion and Adhesives 52, 57-65, 2014 | 69 | 2014 |
Non-destructive evaluation (NDE) of aerospace composites: methods for testing adhesively bonded composites B Ehrhart, B Valeske, C Bockenheimer Non-destructive evaluation (NDE) of polymer matrix composites, 220-237, 2013 | 46 | 2013 |
Next generation NDE sensor systems as IIoT elements of industry 4.0 B Valeske, A Osman, F Römer, R Tschuncky Research in Nondestructive Evaluation 31 (5-6), 340-369, 2020 | 34 | 2020 |
Defect shape detection and defect reconstruction in active thermography by means of two-dimensional convolutional neural network as well as spatiotemporal convolutional LSTM … D Müller, U Netzelmann, B Valeske Quantitative InfraRed Thermography Journal 19 (2), 126-144, 2022 | 26 | 2022 |
Convolutional neural networks for semantic segmentation as a tool for multiclass face analysis in thermal infrared D Müller, A Ehlen, B Valeske Journal of nondestructive evaluation 40 (1), 9, 2021 | 25 | 2021 |
Extended NDT for the quality assessment of adhesive bonded CFRP structures B Ehrhart, B Valeske, R Ecault, M Boustie, L Berthe, C Bockenheimer Smart Material, Structures & NDT in Aerospace Conference. Montreal, Canada …, 2011 | 19 | 2011 |
3D-visualization of ultrasonic NDT data using mixed reality J Rehbein, SJ Lorenz, J Holtmannspötter, B Valeske Journal of Nondestructive Evaluation 41 (1), 26, 2022 | 15 | 2022 |
Low frequency induction thermography for the characterization of hidden cracks in ferromagnetic steel components G Walle, U Netzelmann, C Stumm, B Valeske Proc. 11th Int. Conf. on Quantitative Infrared Thermography (QIRT) 11 (14.6), 2012 | 13 | 2012 |
The state of metal surfaces after blasting treatment Part I: Technical aluminium W Possart, C Bockenheimer, B Valeske Surface and Interface Analysis: An International Journal devoted to the …, 2002 | 11 | 2002 |
Eine thermische Prüftechnik zur Oberflächenrissprüfung leitfähiger Materialien G Walle, B Valeske, U Netzelmann, S Bessert, H Strauß, F Wolf Materials Testing 51 (9), 593-602, 2009 | 10 | 2009 |
Pulsed thermography dataset for training deep learning models Z Wei, A Osman, B Valeske, X Maldague Applied Sciences 13 (5), 2901, 2023 | 9 | 2023 |
Cognitive sensor systems for NDE 4.0: Technology, AI embedding, validation and qualification B Valeske, R Tschuncky, F Leinenbach, A Osman, Z Wei, F Römer, ... tm-Technisches Messen 89 (4), 253-277, 2022 | 8 | 2022 |
Quality assessment of bonded primary CFRP structures by means of laser proof testing B Ehrhart, B Valeske Universität Bremen, 2016 | 7 | 2016 |
Simulation-Based Generation of Representative and Valid Training Data for Acoustic Resonance Testing M Heinrich, U Rabe, B Valeske Applied Sciences 10 (17), 6059, 2020 | 6 | 2020 |
Novel approaches to non-destructive CFRP bond quality assessment C Bockenheimer, B Ehrhart, B Valeske SAE 2011 AeroTech Congress & Exhibition, 2011 | 6 | 2011 |
Process integrated nondestructive testing of laser-hardened components R Kern, R Meyer, WA Theiner, B Valeske Materials Science Forum 210, 687-694, 1996 | 6 | 1996 |