Photonic structures in radiative cooling M Lee, G Kim, Y Jung, KR Pyun, J Lee, BW Kim, SH Ko Light: Science & Applications 12 (1), 134, 2023 | 75 | 2023 |
Band engineering and tuning thermoelectric transport properties of p-type Bi0. 52Sb1. 48Te3 by Pb doping for low-temperature power generation K Kim, G Kim, H Lee, KH Lee, W Lee Scripta Materialia 145, 41-44, 2018 | 57 | 2018 |
Clarification of electronic and thermal transport properties of Pb-, Ag-, and Cu-doped p-type Bi0. 52Sb1. 48Te3 K Kim, G Kim, SI Kim, KH Lee, W Lee Journal of Alloys and Compounds 772, 593-602, 2019 | 47 | 2019 |
Strong Thermopower Enhancement and Tunable Power Factor via Semimetal to Semiconductor Transition in a Transition-Metal Dichalcogenide H Moon, J Bang, S Hong, G Kim, JW Roh, J Kim, W Lee ACS nano 13 (11), 13317-13324, 2019 | 40 | 2019 |
A review on silicide-based materials: thermoelectric and mechanical properties G Kim, H Shin, J Lee, W Lee Metals and Materials International 27, 2205-2219, 2021 | 34 | 2021 |
Synchronized enhancement of thermoelectric properties of higher manganese silicide by introducing Fe and Co nanoparticles G Kim, HS Kim, HS Lee, J Kim, KH Lee, JW Roh, W Lee Nano Energy 72, 104698, 2020 | 34 | 2020 |
Effect of Si content on the thermoelectric transport properties of Ge-doped higher manganese silicides H Lee, G Kim, B Lee, J Kim, SM Choi, KH Lee, W Lee Scripta Materialia 135, 72-75, 2017 | 32 | 2017 |
Up-scaled solid state reaction for synthesis of doped Mg2Si G Kim, H Lee, J Kim, JW Roh, I Lyo, BW Kim, KH Lee, W Lee Scripta Materialia 128, 53-56, 2017 | 29 | 2017 |
Co-doping of Al and Bi to control the transport properties for improving thermoelectric performance of Mg2Si G Kim, J Kim, H Lee, S Cho, I Lyo, S Noh, BW Kim, SW Kim, KH Lee, ... Scripta Materialia 116, 11-15, 2016 | 24 | 2016 |
Dependence of mechanical and thermoelectric properties of Mg2Si-Sn nanocomposites on interface density G Kim, H Lee, HJ Rim, J Kim, K Kim, JW Roh, SM Choi, BW Kim, KH Lee, ... Journal of Alloys and Compounds 769, 53-58, 2018 | 17 | 2018 |
Enhanced thermoelectric properties in Bi/Te core/shell heterostructure nanowires through strain and interface engineering J Kim, G Kim, JH Bahk, JS Noh, W Lee Nano Energy 32, 520-525, 2017 | 17 | 2017 |
Enhanced fracture toughness of Al and Bi co-doped Mg2Si by metal nanoparticle decoration G Kim, H Lee, J Kim, JW Roh, I Lyo, BW Kim, KH Lee, W Lee Ceramics International 43 (15), 12979-12982, 2017 | 16 | 2017 |
Phase Formation and Thermoelectric Properties of Doped Higher Manganese Silicides (Mn15Si26) H Lee, G Kim, B Lee, KH Lee, W Lee Journal of Electronic Materials 46, 3242-3248, 2017 | 16 | 2017 |
Improved trade-off between thermoelectric performance and mechanical reliability of Mg2Si by hybridization of few-layered reduced graphene oxides G Kim, SW Kim, HJ Rim, H Lee, J Kim, JW Roh, BW Kim, KH Lee, W Lee Scripta Materialia 162, 402-407, 2019 | 15 | 2019 |
Suppressed secondary phase generation in thermoelectric higher manganese silicide by fabrication process optimization G Kim, HJ Rim, KH Lee, JW Roh, W Lee Ceramics International 45 (15), 19538-19541, 2019 | 13 | 2019 |
Strain-engineered allotrope-like bismuth nanowires for enhanced thermoelectric performance J Kim, MW Oh, G Kim, JH Bahk, JY Song, SG Jeon, DW Chun, JH Bae, ... Acta Materialia 144, 145-153, 2018 | 12 | 2018 |
Mg2Si-based thermoelectric compounds with enhanced fracture toughness by introduction of dual nanoinclusions G Kim, HJ Rim, H Lee, J Kim, JW Roh, KH Lee, W Lee Journal of Alloys and Compounds 801, 234-238, 2019 | 11 | 2019 |
Strong enhancement of room-temperature thermoelectric properties of Cu-doped Bi2Te2. 7Se0. 3 G Kim, K Lee, H Shin, J Kim, J Chang, JW Roh, W Lee Applied Physics Letters 120 (4), 2022 | 10 | 2022 |
Compressive creep behavior of hot-pressed Mg1. 96Al0. 04Si0. 97Bi0. 03 RA Michi, G Kim, BW Kim, W Lee, DC Dunand Scripta Materialia 148, 10-14, 2018 | 10 | 2018 |
Fabrication of silicide-based thermoelectric nanocomposites: a review G Kim, W Kim, W Lee, G Kim, W Kim, W Lee Journal of the Korean Ceramic Society 56 (5), 435-442, 2019 | 7 | 2019 |