| Effects of Sn grain structure on the electromigration of Sn–Ag solder joints Y Wang, KH Lu, V Gupta, L Stiborek, D Shirley, SH Chae, J Im, PS Ho Journal of Materials Research 27 (8), 1131-1141, 2012 | 69 | 2012 |
| Chip–Package Interaction and Reliability Improvement by Structure Optimization for Ultralow-Interconnects in Flip-Chip Packages X Zhang, Y Wang, JH Im, PS Ho IEEE Transactions on Device and Materials Reliability 12 (2), 462-469, 2012 | 46 | 2012 |
| Effect of Intermetallic Formation on Electromigration Reliability of TSV-Microbump Joints in 3D Interconnect Y Wang, SH Chae, R Dunne, Y Takahashi, K Mawatari, P Steinmann, ... Proc 62nd Electronic Components and Technology Conference (ECTC), 319-325, 2012 | 36 | 2012 |
| Mode II electromigration failure mechanism in Sn-based Pb-free solder joints with Ni under-bump metallization Y Wang, PS Ho Applied Physics Letters 103 (12), 2013 | 23 | 2013 |
| Reliability of Cu pillar bumps for flip-chip packages with ultra low-k dielectrics Y Wang, KH Lu, J Im, PS Ho 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 16 | 2010 |
| Effect of Sn grain structure on electromigration reliability of Pb-free solders Y Wang, KH Lu, V Gupta, L Stiborek, D Shirley, J Im, PS Ho 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 711-716, 2011 | 14 | 2011 |
| Kinetic study of intermetallic growth and its reliability implications in Pb-free Sn-based microbumps in 3D integration Y Wang, SH Chae, J Im, PS Ho 2013 IEEE 63rd Electronic Components and Technology Conference, 1953-1958, 2013 | 6 | 2013 |
| Electromigration and chip-package interaction reliability of flip chip packages with Cu pillar bumps Y Wang | 4 | 2011 |
| Electromigration Reliability of Pb‐Free Solder Joints SH Chae, Y Wang, PS Ho Lead‐Free Solders: Materials Reliability for Electronics, 337-373, 2012 | 2 | 2012 |
| Effects of intermetallic compound formation on reliability of Pb-free Sn-based solders for flip chip and three-dimensional interconnects Y Wang | | 2013 |
