| Corrections to DB Tuckerman, RFW Pease IEEE Electron Device Letters 2, 213-213, 1981 | 6410* | 1981 |
| High-performance heat sinking for VLSI DB Tuckerman, RFW Pease IEEE Electron device letters 2 (5), 126-129, 1981 | 6410 | 1981 |
| HEAT-TRANSFER MICROSTRUCTURES FOR INTEGRATED CIRCUITS (COOLING, HEAT-SINK) DB TUCKERMAN | 378 | 1984 |
| Heat transfer in microchannels—2012 status and research needs SG Kandlikar, S Colin, Y Peles, S Garimella, RF Pease, JJ Brandner, ... Journal of Heat Transfer 135 (9), 091001, 2013 | 351 | 2013 |
| Optimized convective cooling using micromachined structures DB Tuckerman, RF Pease J. Electrochem. Soc 129 (3), C98, 1982 | 235 | 1982 |
| Structure and method of making capped chips having vertical interconnects G Humpston, D Tuckerman, B McWilliams, B Haba, C Mitchell US Patent App. 10/949,674, 2005 | 208 | 2005 |
| Chips having rear contacts connected by through vias to front contacts B Haba, KA Honer, DB Tuckerman, V Oganesian US Patent 8,405,196, 2013 | 207 | 2013 |
| Ultrahigh thermal conductance microstructures for cooling integrated circuits DB Tuckerman, RFW Pease IEEE-Electronics Laboratories Symposium, 145-149, 1982 | 146 | 1982 |
| Demonstration of high‐performance silicon microchannel heat exchangers for laser diode array cooling D Mundinger, R Beach, W Benett, R Solarz, W Krupke, R Staver, ... Applied physics letters 53 (12), 1030-1032, 1988 | 121 | 1988 |
| Packaged acoustic and electromagnetic transducer chips G Humpston, P Osborn, J Thompson, Y Kubota, CC Tseng, R Burtzlaff, ... US Patent App. 11/068,831, 2005 | 114 | 2005 |
| Chips having rear contacts connected by through vias to front contacts B Haba, KA Honer, DB Tuckerman, V Oganesian US Patent 8,310,036, 2012 | 94 | 2012 |
| A Josephson ultrahigh‐resolution sampling system DB Tuckerman Applied Physics Letters 36 (12), 1008-1010, 1980 | 82 | 1980 |
| Flexible superconducting Nb transmission lines on thin film polyimide for quantum computing applications DB Tuckerman, MC Hamilton, DJ Reilly, R Bai, GA Hernandez, ... Superconductor Science and Technology 29 (8), 084007, 2016 | 80 | 2016 |
| Structure and method of making lidded chips D Tuckerman, G Humpston, M Nystrom, M Beroz, J Thompson US Patent App. 11/711,595, 2008 | 73 | 2008 |
| Resonances in symmetric Josephson interferometers DB Tuckerman, JH Magerlein Applied Physics Letters 37 (2), 241-243, 1980 | 71 | 1980 |
| Structure and method of making lidded chips D Tuckerman, G Humpston, M Nystrom, C Goudge, A Woll US Patent App. 11/713,804, 2008 | 68 | 2008 |
| Structure and method of making lidded chips D Tuckerman, G Humpston, M Nystrom US Patent App. 11/711,882, 2008 | 64 | 2008 |
| Back-face and edge interconnects for lidded package R Burtzlaff, B Haba, G Humpston, D Tuckerman, M Warner, C Mitchell US Patent App. 11/641,141, 2007 | 61 | 2007 |
| Package having integral lens and wafer-scale fabrication method therefor C De Villeneuve, G Humpston, D Tuckerman US Patent App. 10/928,839, 2005 | 56 | 2005 |
| Multichip module having SiO2 insulating layer DB Tuckerman US Patent 5,274,270, 1993 | 54 | 1993 |
