| High-frequency scalable modeling and analysis of a differential signal through-silicon via J Kim, J Cho, J Kim, JM Yook, JC Kim, J Lee, K Park, JS Pak IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (4 …, 2014 | 76 | 2014 |
| Interposer power distribution network (PDN) modeling using a segmentation method for 3-D ICs with TSVs K Kim, JM Yook, J Kim, H Kim, J Lee, K Park, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013 | 49 | 2013 |
| 30 Gbps high-speed characterization and channel performance of coaxial through silicon via DH Jung, H Kim, S Kim, JJ Kim, B Bae, J Kim, JM Yook, JC Kim, J Kim IEEE Microwave and Wireless Components Letters 24 (11), 814-816, 2014 | 40 | 2014 |
| Compact mm-wave bandpass filters using silicon integrated passive device technology DM Kim, BW Min, JM Yook IEEE Microwave and Wireless Components Letters 29 (10), 638-640, 2019 | 34 | 2019 |
| Silicon-core coaxial through silicon via for low-loss RF Si-interposer WC Lee, BW Min, JC Kim, JM Yook IEEE Microwave and Wireless Components Letters 27 (5), 428-430, 2017 | 29 | 2017 |
| High performance IPDs (integrated passive devices) and TGV (through glass via) interposer technology using the photosensitive glass JM Yook, D Kim, JC Kim 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 41-46, 2014 | 28 | 2014 |
| High density and low-cost silicon interposer using thin-film and organic lamination processes JM Yook, JC Kim, SH Park, JI Ryu, JC Park 2012 IEEE 62nd Electronic Components and Technology Conference, 274-278, 2012 | 27 | 2012 |
| Ultrawideband signal transition using quasi-coaxial through-silicon-via (TSV) for mm-wave IC packaging JM Yook, YG Kim, W Kim, S Kim, JC Kim IEEE Microwave and Wireless Components Letters 30 (2), 167-169, 2020 | 23 | 2020 |
| High-frequency through-silicon Via (TSV) failure analysis J Kim, J Cho, JS Pak, J Kim, JM Yook, JC Kim 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging …, 2011 | 22 | 2011 |
| A compact switched beam-forming network using silicon IPD technology for low-cost 5G communication WC Lee, BW Min, CY Kim, JC Kim, JM Yook 2016 IEEE MTT-S International Microwave Symposium (IMS), 1-3, 2016 | 20 | 2016 |
| A compact and low-profile GaN power amplifier using interposer-based MMIC technology D Kim, JM Yook, SJ An, SR Kim, JG Yook, JC Kim 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 672-675, 2014 | 19 | 2014 |
| High-quality solenoid inductor using dielectric film for multichip modules JM Yook, JH Ko, ML Ha, YS Kwon IEEE transactions on microwave theory and techniques 53 (6), 2230-2234, 2005 | 19 | 2005 |
| Suspended spiral inductor and band-pass filter on thick anodized aluminum oxide JM Yook, KM Kim, YS Kwon IEEE microwave and wireless components letters 19 (10), 620-622, 2009 | 18 | 2009 |
| 28 GHz GaAs pHEMT MMICs and RF front‐end module for 5G communication systems HJ Ahn, WI Chang, SM Kim, BJ Park, JM Yook, YS Eo Microwave and Optical Technology Letters 61 (4), 878-882, 2019 | 16 | 2019 |
| High-frequency measurements of TSV failures J Kim, D Jung, J Cho, JS Pak, JM Yook, JC Kim, J Kim 2012 IEEE 62nd Electronic Components and Technology Conference, 298-303, 2012 | 16 | 2012 |
| Embedded IC technology for compact packaging inside aluminum substrate (pocket embedded packaging) KM Kim, JM Yook, SK Yeo, YS Kwon 2007 European Microwave Conference, 1125-1128, 2007 | 15 | 2007 |
| Thickness-dependent tunable characteristics of (Ba0. 5Sr0. 5) 0.925 K0. 075TiO3 thin films prepared by pulsed laser deposition KC Sekhar, SH Key, KP Hong, CS Han, JM Yook, DS Kim, JC Kim, ... Current Applied Physics 12 (3), 654-658, 2012 | 14 | 2012 |
| An X-band high power amplifier module package using selectively anodized aluminum substrate SK Yeo, JH Chun, KM Kim, JM Yook, YS Kwon 2007 European Microwave Conference, 1357-1360, 2007 | 14 | 2007 |
| High-performance RF inductors and capacitors using the reverse trench structure of silicon JM Yook, D Kim, JC Kim IEEE Microwave and Wireless Components Letters 25 (11), 709-711, 2015 | 13 | 2015 |
| Frequency and time domain measurement of through-silicon via (TSV) failure DH Jung, J Kim, H Kim, JJ Kim, J Kim, JS Pak, JM Yook, JC Kim 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging …, 2012 | 13 | 2012 |
