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Bruno Neckel Wesling
Bruno Neckel Wesling
其他姓名Bruno Neckel
在 u-bordeaux.fr 的电子邮件经过验证
标题
引用次数
引用次数
年份
Enhanced Electrochemical Performance of Nanocellulose/PPy·CuCl2 Electrodes for All-Cellulose-Based Supercapacitors
BN Wesling, GMV Dias, D Müller, RB Serpa, D Hotza, CR Rambo
Journal of Electronic Materials 49, 1036-1042, 2020
172020
Aerogel‐Based TiO2 Stable Inks for Direct Inkjet Printing of Nanostructured Layers
AM Barreiro, GK Pinheiro, BN Wesling, D Müller, LT Scarabelot, ...
Advances in Materials Science and Engineering 2020 (1), 4273097, 2020
142020
Enhancing Specific Capacitance and Cyclic Stability through Incorporation of MnO2 into Bacterial Nanocellulose/PPy·CuCl2 Flexible Electrodes
GMV Dias, D Müller, BN Wesling, JC Bernardes, D Hotza, CR Rambo
Energy Technology 7 (9), 1900328, 2019
122019
Preparation and electrochemical capacitance of high surface area TiO2–RuO2 aerogels
GMV Dias, JC Bernardes, BN Wesling, D Müller, LS Marques, CR Rambo
Open Ceramics 8, 100196, 2021
72021
Extraction of small-signal equivalent circuit for de-embedding of 3D vertical nanowire transistor
BN Wesling, M Deng, C Mukherjee, M de Matos, A Kumar, G Larrieu, ...
Solid-State Electronics 194, 108359, 2022
62022
A CMOS test chip with simple post-processing steps for dry characterization of ISFET arrays
R Wrege, C Peter, BN Wesling, CR Rambo, MC Schneider, ...
IEEE Sensors Journal 21 (4), 4755-4763, 2020
62020
One‐Step Synthesis of Conductive BNC/PPy·CuCl2 Hybrid Flexible Nanocomposites by In Situ Polymerization
D Müller, BN Wesling, GMV Dias, JC Bernardes, LM Porto, CR Rambo, ...
Advances in Materials Science and Engineering 2018 (1), 2314794, 2018
42018
strategies for characterization and parameter extraction of vertical junction-less nanowire FETs dedicated to design technology co-optimization
C Maneux, C Mukherjee, M Deng, G Larrieu, W Yifang, B Wesling, ...
ECS Transactions 111 (1), 209, 2023
22023
Understanding the Substrate Effect on De-embedding Structures Fabricated on SOI Wafers Using Electromagnetic Simulation
BN Wesling, M Deng, C Mukherjee, T Mikolajick, J Trommer, C Maneux
2024 IEEE 36th International Conference on Microelectronic Test Structures …, 2024
2024
FVLLMONTI: The 3D Neural Network Compute Cube Concept for Efficient Transformer Architectures Towards Speech-to-Speech Translation
I O'Connor, S Mannaa, A Bosio, B Deveautour, D Deleruyelle, ...
2024 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6, 2024
2024
Advancements in HZO Layer Engineering for Ultimate 3D Vertical Transistors: Towards a Logic-In-Memory Application
K Moustakas, B Neckel, A Lecestre, F Mathieu, T Mikolajick, J Trommer, ...
European Materials Research Society (EMRS) fall meeting 2023, 2023
2023
Engineering of HZO layer for the fabrication of ultimate 3D vertical transistors for Memory-in-Logic applications M. Materials engineering for advanced semiconductor devices
K Moustakas, B Neckel, A Lecestre, F Mathieu, T Mikolajick, J Trommer, ...
European Materials Research Society (EMRS) spring meeting 2023, 2023
2023
Circuit Design Flow dedicated to 3D vertical nanowire FET
C Maneux, C Mukherjee, M Deng, BN Wesling, L Réveil, Z Stanojevic, ...
2022 IEEE Latin American Electron Devices Conference (LAEDC), 1-4, 2022
2022
ENC-2022-0724 Experimental Evaluation on the effect of magnetite in aerogel form on the dielectric breakdown strength and thermal conductivity of a synthetic isolating oil
LA Militão, AK da Silva, JR Barbosa Jr, DM Machado, JC Bernardes, ...
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