| Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits AS Budiman, HAS Shin, BJ Kim, SH Hwang, HY Son, MS Suh, QH Chung, ... Microelectronics Reliability 52 (3), 530-533, 2012 | 149 | 2012 |
| Atomic migration in molten and crystalline Ge2Sb2Te5 under high electric field TY Yang, IM Park, BJ Kim, YC Joo Applied Physics Letters 95 (3), 2009 | 124 | 2009 |
| Crack nucleation during mechanical fatigue in thin metal films on flexible substrates BJ Kim, SY Jung, Y Cho, O Kraft, IS Choi, YC Joo Acta Materialia 61 (9), 3473-3481, 2013 | 106 | 2013 |
| Temperature effect on intermetallic compound growth kinetics of Cu pillar/Sn bumps GT Lim, BJ Kim, K Lee, J Kim, YC Joo, YB Park Journal of electronic materials 38, 2228-2233, 2009 | 105 | 2009 |
| Electrospun ion gel nanofibers for flexible triboelectric nanogenerator: electrochemical effect on output power BU Ye, BJ Kim, J Ryu, JY Lee, JM Baik, K Hong Nanoscale 7 (39), 16189-16194, 2015 | 86 | 2015 |
| Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing HAS Shin, BJ Kim, JH Kim, SH Hwang, AS Budiman, HY Son, KY Byun, ... Journal of electronic materials 41 (4), 712-719, 2012 | 85 | 2012 |
| Bending strain and bending fatigue lifetime of flexible metal electrodes on polymer substrates TW Kim, JS Lee, YC Kim, YC Joo, BJ Kim Materials 12 (15), 2490, 2019 | 69 | 2019 |
| Reliability issues and solutions in flexible electronics under mechanical fatigue SM Yi, IS Choi, BJ Kim, YC Joo Electronic Materials Letters 14, 387-404, 2018 | 57 | 2018 |
| Intermetallic compound growth and reliability of Cu pillar bumps under current stressing BJ Kim, GT Lim, J Kim, K Lee, YB Park, HY Lee, YC Joo Journal of electronic materials 39, 2281-2285, 2010 | 57 | 2010 |
| Fatigue‐free, electrically reliable copper electrode with nanohole array BJ Kim, Y Cho, MS Jung, HAS Shin, MW Moon, HN Han, KT Nam, YC Joo, ... Small 8 (21), 3300-3306, 2012 | 53 | 2012 |
| Improving mechanical fatigue resistance by optimizing the nanoporous structure of inkjet-printed Ag electrodes for flexible devices BJ Kim, T Haas, A Friederich, JH Lee, DH Nam, JR Binder, W Bauer, ... Nanotechnology 25 (12), 125706, 2014 | 50 | 2014 |
| Effect of film thickness on the stretchability and fatigue resistance of Cu films on polymer substrates BJ Kim, JH Lee, TY Yang, T Haas, P Gruber, IS Choi, O Kraft, YC Joo Journal of Materials Research 29 (23), 2827-2834, 2014 | 48 | 2014 |
| Effect of cyclic outer and inner bending on the fatigue behavior of a multi-layer metal film on a polymer substrate BJ Kim, JH Lee, YC Joo Japanese Journal of Applied Physics 55 (6S3), 06JF01, 2016 | 45 | 2016 |
| Improved mechanical performance of solution-processed MWCNT/Ag nanoparticle composite films with oxygen-pressure-controlled annealing JH Lee, NR Kim, BJ Kim, YC Joo Carbon 50 (1), 98-106, 2012 | 44 | 2012 |
| Interfacial reaction effect on electrical reliability of Cu pillar/Sn bumps MH Jeong, GT Lim, BJ Kim, KW Lee, JD Kim, YC Joo, YB Park journal of Electronic Materials 39, 2368-2374, 2010 | 30 | 2010 |
| Electrical and mechanical properties of through-silicon vias and bonding layers in stacked wafers for 3D integrated circuits SH Hwang, BJ Kim, HY Lee, YC Joo Journal of electronic materials 41, 232-240, 2012 | 24 | 2012 |
| Bias polarity and frequency effects of Cu-induced dielectric breakdown in damascene Cu interconnects SY Jung, BJ Kim, NY Lee, BM Kim, SJ Yeom, NJ Kwak, YC Joo Microelectronic Engineering 89, 58-61, 2012 | 23 | 2012 |
| Effect of isothermal aging on intermetallic compounds and Kirkendall void growth kinetics of Au stud bumps GT Lim, BJ Kim, K Lee, J Kim, YC Joo, YB Park Metals and Materials International 15, 819-823, 2009 | 20 | 2009 |
| Continuous 1D-metallic microfibers web for flexible organic solar cells K Hong, J Ham, BJ Kim, JY Park, DC Lim, JY Lee, JL Lee ACS applied materials & interfaces 7 (49), 27397-27404, 2015 | 18 | 2015 |
| Highly conductive and smooth surfaced flexible transparent conductive electrode based on silver nanowires MA Shinde, DJ Lee, BJ Kim, H Kim Thin Solid Films 685, 366-371, 2019 | 17 | 2019 |
