| Highly compressive boron nitride nanotube aerogels reinforced with reduced graphene oxide M Wang, T Zhang, D Mao, Y Yao, X Zeng, L Ren, Q Cai, S Mateti, LH Li, ... ACS nano 13 (7), 7402-7409, 2019 | 141 | 2019 |
| A pH-responsive hydrophilic controlled release system based on ZIF-8 for self-healing anticorrosion application C Yang, W Xu, X Meng, X Shi, L Shao, X Zeng, Z Yang, S Li, Y Liu, X Xia Chemical Engineering Journal 415, 128985, 2021 | 120 | 2021 |
| Thermal interface materials with both high through-plane thermal conductivity and excellent elastic compliance J Li, Y Zhang, T Liang, X Bai, Y Pang, X Zeng, Q Hu, W Tu, Z Ye, G Du, ... Chemistry of Materials 33 (22), 8926-8937, 2021 | 52 | 2021 |
| High thermal conductivity and remarkable damping composite gels as thermal interface materials for heat dissipation of chip SC Ding, JF Fan, DY He, LF Cai, XL Zeng, LL Ren, GP Du, XL Zeng, ... Chip 1 (2), 100013, 2022 | 34 | 2022 |
| Soft composite gels with high toughness and low thermal resistance through lengthening polymer strands and controlling filler L Cai, J Fan, S Ding, D He, X Zeng, R Sun, L Ren, J Xu, X Zeng Advanced Functional Materials 33 (2), 2207143, 2023 | 33 | 2023 |
| Room-temperature welding of silver telluride nanowires for high-performance thermoelectric film X Zeng, L Ren, J Xie, D Mao, M Wang, X Zeng, G Du, R Sun, JB Xu, ... ACS applied materials & interfaces 11 (41), 37892-37900, 2019 | 32 | 2019 |
| Flexible pCu2Se-nAg2Se thermoelectric devices via in situ conversion from printed Cu patterns J Xie, M Han, X Zeng, D Mao, H Li, X Zeng, R Liu, L Ren, R Sun, J Xu Chemical Engineering Journal 435, 135172, 2022 | 30 | 2022 |
| Heat conduction of electrons and phonons in thermal interface materials Y Zhao, X Zeng, L Ren, X Xia, X Zeng, J Zhou Materials Chemistry Frontiers 5 (15), 5617-5638, 2021 | 28 | 2021 |
| Interfacial coordination interaction enables soft elastomer composites high thermal conductivity and high toughness D He, Z Wang, X Zeng, J Fan, L Ren, G Du, R Sun, X Zeng ACS Applied Materials & Interfaces 14 (29), 33912-33921, 2022 | 26 | 2022 |
| Unveiling the role of filler surface energy in enhancing thermal conductivity and mechanical properties of thermal interface materials Q Ma, Z Wang, T Liang, Y Su, J Li, Y Yao, X Zeng, Y Pang, M Han, X Zeng, ... Composites Part A: Applied Science and Manufacturing 157, 106904, 2022 | 25 | 2022 |
| Gecko-inspired adhesive structures enable efficiently thermal conductance and vibration dissipation in a highly mismatched system J Fan, S Ding, X Zeng, S Gao, Z Wen, X Zeng, R Sun, L Ren Chemical Engineering Journal 445, 136754, 2022 | 24 | 2022 |
| Liquid bridge: liquid metal bridging spherical BN largely enhances the thermal conductivity and mechanical properties of thermal interface materials J Li, Q Ma, S Gao, T Liang, Y Pang, X Zeng, Y Li, X Zeng, R Sun, L Ren Journal of Materials Chemistry C 10 (17), 6736-6743, 2022 | 21 | 2022 |
| Ultrahigh energy-dissipation thermal interface materials through anneal-induced disentanglement X Zeng, X Zeng, J Fan, J Li, Z Wang, R Sun, L Ren, X Xia ACS Materials Letters 4 (5), 874-881, 2022 | 20 | 2022 |
| The synergy of hydrogen bond and entanglement of elastomer captures unprecedented flaw insensitivity rate X Zeng, L Xu, X Xia, X Bai, C Zhong, J Fan, L Ren, R Sun, X Zeng Small 19 (16), 2207409, 2023 | 15 | 2023 |
| Damping, soft, and thermally conductive composite elastomer via introducing bottlebrush chains S Rao, X Zeng, X Cheng, J Fan, D He, L Ren, G Du, X Zeng Chemical Engineering Journal 474, 145847, 2023 | 13 | 2023 |
| Adaptable thermal conductive, high toughness and compliant Poly (dimethylsiloxane) elastomer composites based on interfacial coordination bonds Y Ji, Z Wen, J Fan, X Zeng, X Zeng, R Sun, L Ren Composites Science and Technology 231, 109840, 2023 | 11 | 2023 |
| Stretchable thermal interface materials by tailoring the Chain relaxation at the filler/polymer interface W Ye, Z Ye, T Liang, X Zeng, Z Wen, L Ren, R Sun, X Zeng ACS Applied Polymer Materials 4 (7), 4653-4663, 2022 | 10 | 2022 |
| High damping, soft and reprocessable thermal interface materials inspired by the microstructure of skin tissue S Rao, J Fan, Y Zhou, X Zeng, X Cheng, G Du, X Zeng, R Sun, L Ren Composites Science and Technology 247, 110428, 2024 | 8 | 2024 |
| Elastomer composites with high damping and low thermal resistance via hierarchical interactions and regulating filler X Zeng, Y Zhou, X Xia, J Fan, S Rao, L Ren, X Shen, R Sun, X Zeng Small 20 (22), 2306946, 2024 | 7 | 2024 |
| Effects of aging on macro performance and multiscale structure change of highly filled elastomer composites for chip cooling investigated by broadband dielectric spectroscopy J Fang, X Zeng, M Wang, X Zeng, Y Wu, L Ren, R Sun ACS Applied Polymer Materials 6 (1), 768-777, 2023 | 4 | 2023 |
Rong SunShenzhen Institutes of Advanced Technology, Chinese Academy of Sciences在 siat.ac.cn 的电子邮件经过验证
