| Anisotropic thermal conductive composite by the guided assembly of boron nitride nanosheets for flexible and stretchable electronics H Hong, YH Jung, JS Lee, C Jeong, JU Kim, S Lee, H Ryu, H Kim, Z Ma, ... Advanced Functional Materials 29 (37), 1902575, 2019 | 174 | 2019 |
| A liquid metal mediated metallic coating for antimicrobial and antiviral fabrics KY Kwon, S Cheeseman, A Frias‐De‐Diego, H Hong, J Yang, W Jung, ... Advanced Materials 33 (45), 2104298, 2021 | 122 | 2021 |
| Effective assembly of nano-ceramic materials for high and anisotropic thermal conductivity in a polymer composite H Hong, JU Kim, T Kim Polymers 9 (9), 413, 2017 | 90 | 2017 |
| A semi-permanent and durable nanoscale-crack-based sensor by on-demand healing B Park, S Lee, H Choi, JU Kim, H Hong, C Jeong, D Kang, T Kim Nanoscale 10 (9), 4354-4360, 2018 | 62 | 2018 |
| Omnidirectional, Broadband Light Absorption in a Hierarchical Nanoturf Membrane for an Advanced Solar‐Vapor Generator JU Kim, SJ Kang, S Lee, J Ok, Y Kim, SH Roh, H Hong, JK Kim, H Chae, ... Advanced Functional Materials 30 (50), 2003862, 2020 | 54 | 2020 |
| On-demand drug release from gold nanoturf for a thermo-and chemotherapeutic esophageal stent S Lee, G Hwang, TH Kim, SJ Kwon, JU Kim, K Koh, B Park, H Hong, ... ACS nano 12 (7), 6756-6766, 2018 | 40 | 2018 |
| Avoiding heating interference and guided thermal conduction in stretchable devices using thermal conductive composite islands SJ Kang, H Hong, C Jeong, JS Lee, H Ryu, J Yang, JU Kim, YJ Shin, ... Nano Research 14, 3253-3259, 2021 | 26 | 2021 |
| Solvent-assisted filling of liquid metal and its selective dewetting for the multilayered 3D interconnect in stretchable electronics W Jung, GR Koirala, JS Lee, JU Kim, B Park, YJ Jo, C Jeong, H Hong, ... ACS nano 16 (12), 21471-21481, 2022 | 11 | 2022 |
| Colloidal Engineering of Microplastic Capture with Biodegradable Soft Dendritic “Microcleaners” RS Bang, L Verster, H Hong, L Pal, OD Velev Langmuir 40 (11), 5923-5933, 2024 | 2 | 2024 |
| Non-yellowish and heat-resistant adhesive for a transparent heat sinking film H Ryu, H Choi, J hwan Shin, H Hong, B Park, EG Lee, T Kim Journal of Industrial and Engineering Chemistry 103, 275-282, 2021 | 2 | 2021 |
| Hierarchically Fibrillar Biopolymer Nanostructures for Microplastics Remediation and Sustainable Polymer Substitutes H Hong, R Bang, Y Kotb, LV Rivera, M Ahmad, B Kim, OD Velev 2024 AIChE Annual Meeting, 2024 | | 2024 |
| Solvent-Assisted Filling of Liquid Metal and Its Selective Dewetting for the Multilayered 3D Interconnect in Stretchable Electronics (vol 16, 21471, 2022) W Jung, GR Koirala, JS Lee, JU Kim, B Park, YJ Jo, C Jeong, H Hong, ... ACS NANO, 2023 | | 2023 |
