| Electrical modeling and analysis of tapered through-package via in glass interposers J Tong, Y Sato, K Panayappan, V Sundaram, AF Peterson, RR Tummala IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (5 …, 2016 | 29 | 2016 |
| First demonstration of reliable copper-plated 30μm diameter through-package-vias in ultra-thin bare glass interposers K Demir, A Armutlulu, J Tong, R Pucha, V Sundaram, R Tummala 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1098-1102, 2014 | 25 | 2014 |
| Substrate-integrated waveguides in glass interposers with through-package-vias J Tong, V Sundaram, A Shorey, R Tummala 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2222-2227, 2015 | 23 | 2015 |
| Design and demonstration of 2.5 D glass interposers as a superior alternative to silicon interposers for 28 Gbps signal transmission B Sawyer, BC Chou, J Tong, W Vis, K Panayappan, S Deng, H Tournier, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 972-977, 2016 | 22 | 2016 |
| Characterization of electrical properties of glass and transmission lines on thin glass up to 50 GHz WT Khan, J Tong, S Sitaraman, V Sundaram, R Tummala, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2138-2143, 2015 | 20 | 2015 |
| Electrical comparison between TSV in silicon and TPV in glass for interposer and package applications J Tong, K Panayappan, V Sundaram, R Tummala 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2581-2587, 2016 | 13 | 2016 |
| High-frequency characterization of through package vias formed by focused electrical-discharge in thin glass interposers J Tong, Y Sato, S Takahashi, N Imajyo, AF Peterson, V Sundaram, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2271-2276, 2014 | 13 | 2014 |
| Via-first process to enable copper metallization of glass interposers with high-aspect-ratio, fine-pitch through-package-vias TB Huang, B Chou, J Tong, T Ogawa, V Sundaram, RR Tummala IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (4 …, 2017 | 5 | 2017 |
| Thermal runaway prediction based on electrothermal models in nanotechnologies J Tong, X Li, J Mao 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2011 | 5 | 2011 |
| Temperature-dependent device behavior in advanced CMOS technologies X Li, J Tong, J Mao 2010 International Symposium on Signals, Systems and Electronics 2, 1-4, 2010 | 3 | 2010 |
| Electrical modeling design and characterization of tapered through-package-vias in glass interposers for high-performance applications J Tong Georgia Institute of Technology, 2016 | 2 | 2016 |
| Modeling and analysis of electrothermal effects on global ULSI interconnects X Li, J Tong, Y Shao, J Mao 2010 IEEE Electrical Design of Advanced Package & Systems Symposium, 1-4, 2010 | 2 | 2010 |
| Gradient index metamaterials based on dielectric disks D Bao, W Qin, J Tong, XM Yang, Q Cheng, TJ Cui 2008 International Workshop on Metamaterials, 394-396, 2008 | 2 | 2008 |
| High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass Interposer V Sundaram, J Tong, K Demir, T Huang, A Shorey, S Pollard, R Tummala International Symposium on Microelectronics 2014 (1), 000402-000408, 2014 | 1 | 2014 |
| Large Silicon, Glass or Low-CTE Organic Package to Printed Wiring Board SMT Interconnections VSRT P. M. Raj, Xian Qin, Jialing Tong, Gary Menezes http://www.chipscalereview.com/legacy/tech_monthly/csrtm-0713-smt …, 2013 | | 2013 |
| The network analysis of chiral cascaded circuit and its novel application on directional coupler XM Yang, J Tong, W Qin, TJ Cui 2008 International Workshop on Metamaterials, 400-404, 2008 | | 2008 |
