| Design of novel low-density refractory high entropy alloys for high-temperature applications ZQ Xu, ZL Ma, M Wang, YW Chen, YD Tan, XW Cheng Materials Science and Engineering: A 755, 318-322, 2019 | 79 | 2019 |
| Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5 Cu solders ZL Ma, SA Belyakov, CM Gourlay Journal of Alloys and Compounds 682, 326-337, 2016 | 79 | 2016 |
| Microstructures and mechanical properties of HfNbTaTiZrW and HfNbTaTiZrMoW refractory high-entropy alloys M Wang, Z Ma, Z Xu, X Cheng Journal of Alloys and Compounds 803, 778-785, 2019 | 72 | 2019 |
| Designing VxNbMoTa refractory high-entropy alloys with improved properties for high-temperature applications M Wang, ZL Ma, ZQ Xu, XW Cheng Scripta Materialia 191, 131-136, 2021 | 70 | 2021 |
| Nucleation of tin on the Cu6Sn5 layer in electronic interconnections JW Xian, ZL Ma, SA Belyakov, M Ollivier, CM Gourlay Acta Materialia 123, 404-415, 2017 | 69 | 2017 |
| Nucleation and growth of tin in Pb-free solder joints CM Gourlay, SA Belyakov, ZL Ma, JW Xian Jom 67, 2383-2393, 2015 | 66 | 2015 |
| Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections ZL Ma, SA Belyakov, K Sweatman, T Nishimura, T Nishimura, CM Gourlay Nature Communications 8 (1), 1916, 2017 | 59 | 2017 |
| Designing TiVNbTaSi refractory high-entropy alloys with ambient tensile ductility ZQ Xu, ZL Ma, Y Tan, XW Cheng Scripta Materialia 206, 114230, 2022 | 45 | 2022 |
| Nucleation, grain orientations, and microstructure of Sn-3Ag-0.5 Cu soldered on cobalt substrates ZL Ma, CM Gourlay Journal of Alloys and Compounds 706, 596-608, 2017 | 42 | 2017 |
| Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds ZL Ma, JW Xian, SA Belyakov, CM Gourlay Acta Materialia 150, 281-294, 2018 | 41 | 2018 |
| Grain refinement of electronic solders: The potential of combining solute with nucleant particles H Shang, ZL Ma, SA Belyakov, CM Gourlay Journal of alloys and compounds 715, 471-485, 2017 | 33 | 2017 |
| Sn addition on the tensile properties of high temperature Zn–4Al–3Mg solder alloys F Cheng, F Gao, Y Wang, Y Wu, Z Ma, J Yang Microelectronics Reliability 52 (3), 579-584, 2012 | 27 | 2012 |
| Microstructures and mechanical properties of CoCrFeNiHfx high-entropy alloys ZQ Xu, ZL Ma, GH Xia, M Wang, TB Xie, XW Cheng Materials Science and Engineering: A 792, 139820, 2020 | 23 | 2020 |
| Effects of vanadium concentration on mechanical properties of VxNbMoTa refractory high-entropy alloys M Wang, ZL Ma, ZQ Xu, XW Cheng Materials Science and Engineering: A 808, 140848, 2021 | 22 | 2021 |
| Mechanisms of beta-Sn nucleation and microstructure evolution in Sn-Ag-Cu solders containing titanium ZL Ma, H Shang, AA Daszki, SA Belyakov, CM Gourlay Journal of Alloys and Compounds 777, 1357-1366, 2019 | 22 | 2019 |
| Microstructural and mechanical properties of in-situ micro-laminated TiC/Ti composite synthesised Y Tan, H Cai, X Cheng, Z Ma, Z Xu, Z Zhou Materials Letters 228, 1-4, 2018 | 21 | 2018 |
| Static and dynamic mechanical properties of Yttrium Aluminum Garnet (YAG) W Jiang, X Cheng, Z Xiong, Z Ma, T Ali, H Cai, J Zhang Ceramics International 45 (9), 12256-12263, 2019 | 20 | 2019 |
| Effects of Si additions on microstructures and mechanical properties of VNbTiTaSix refractory high-entropy alloys ZQ Xu, ZL Ma, Y Tan, M Wang, Y Zhao, XW Cheng Journal of Alloys and Compounds 900, 163517, 2022 | 19 | 2022 |
| Influence of tantalum on mechanical, ferroelectric and dielectric properties of Bi-excess Bi3. 25La0. 75Ti3O12 thin film S Ma, X Cheng, T Ali, Z Ma, Z Xu, R Chu Applied Surface Science 463, 1141-1147, 2019 | 18 | 2019 |
| Dynamic response and damage evolution of Zr-based bulk metallic glass under shock loading Y Li, X Cheng, Z Ma, X Li, M Wang Journal of Materials Science & Technology 93, 119-127, 2021 | 15 | 2021 |
Christopher M. GourlayDepartment of Materials, Imperial College London在 imperial.ac.uk 的电子邮件经过验证
