Ubiquitous relaxation in BTI stressing—New evaluation and insights B Kaczer, T Grasser, J Roussel, J Martin-Martinez, R O'Connor, ... 2008 IEEE International Reliability Physics Symposium, 20-27, 2008 | 306 | 2008 |
Simultaneous extraction of recoverable and permanent components contributing to bias-temperature instability T Grasser, B Kaczer, P Hehenberger, W Gos, R O'Connor, H Reisinger, ... 2007 IEEE International Electron Devices Meeting, 801-804, 2007 | 152 | 2007 |
Recyclability of stainless steel (316 L) powder within the additive manufacturing process NE Gorji, R O'Connor, A Mussatto, M Snelgrove, PGM González, ... Materialia 8, 100489, 2019 | 72 | 2019 |
Comprehensive assessment of spatter material generated during selective laser melting of stainless steel MA Obeidi, A Mussatto, R Groarke, RK Vijayaraghavan, A Conway, ... Materials Today Communications 25, 101294, 2020 | 54 | 2020 |
Implications of progressive wear-out for lifetime extrapolation of ultra-thin (EOT/spl sim/1 nm) SiON films B Kaczer, R Degraeve, R O'Connor, P Roussel, G Groeseneken IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004 …, 2004 | 53 | 2004 |
A new method for assessing the recyclability of powders within Powder Bed Fusion process NE Gorji, P Saxena, M Corfield, A Clare, JP Rueff, J Bogan, ... Materials Characterization 161, 110167, 2020 | 52 | 2020 |
Tuning of oxygen vacancy-induced electrical conductivity in Ti-doped hematite films and its impact on photoelectrochemical water splitting P Biswas, A Ainabayev, A Zhussupbekova, F Jose, R O’connor, A Kaisha, ... Scientific Reports 10 (1), 7463, 2020 | 41 | 2020 |
SILC defect generation spectroscopy in HfSiON using constant voltage stress and substrate hot electron injection R O'Connor, L Pantisano, R Degraeve, T Kauerauf, B Kaczer, PJ Roussel, ... 2008 IEEE International Reliability Physics Symposium, 324-329, 2008 | 32 | 2008 |
Area-selective ALD of Ru on nanometer-scale Cu lines through dimerization of amino-functionalized alkoxy silane passivation films I Zyulkov, V Madhiwala, E Voronina, M Snelgrove, J Bogan, R O’Connor, ... ACS applied materials & interfaces 12 (4), 4678-4688, 2020 | 31 | 2020 |
Methodologies for sub-1nm EOT TDDB evaluation T Kauerauf, R Degraeve, LÅ Ragnarsson, P Roussel, S Sahhaf, ... 2011 International Reliability Physics Symposium, 2A. 2.1-2A. 2.10, 2011 | 31 | 2011 |
X-ray tomography, AFM and nanoindentation measurements for recyclability analysis of 316L powders in 3D printing process NE Gorji, R O’Connor, D Brabazon Procedia Manufacturing 47, 1113-1116, 2020 | 30 | 2020 |
XPS, XRD, and SEM characterization of the virgin and recycled metallic powders for 3D printing applications NE Gorji, R O’Connor, D Brabazon IOP Conference Series: Materials Science and Engineering 591 (1), 012016, 2019 | 28 | 2019 |
On the use of (3-trimethoxysilylpropyl) diethylenetriamine self-assembled monolayers as seed layers for the growth of Mn based copper diffusion barrier layers A Brady-Boyd, R O’Connor, S Armini, V Selvaraju, G Hughes, J Bogan Applied Surface Science 427, 260-266, 2018 | 28 | 2018 |
XPS, SEM, AFM, and nano-indentation characterization for powder recycling within additive manufacturing process NE Gorji, R O’connor, D Brabazon IOP Conference Series: Materials Science and Engineering 1182 (1), 012025, 2021 | 24 | 2021 |
Nucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers J Bogan, A Brady-Boyd, S Armini, R Lundy, V Selvaraju, R O'Connor Applied Surface Science 462, 38-47, 2018 | 22 | 2018 |
Photoemission study of the identification of Mn silicate barrier formation on carbon containing low-κ dielectrics J Bogan, AP McCoy, R O’Connor, P Casey, C Byrne, G Hughes Microelectronic engineering 130, 46-51, 2014 | 20 | 2014 |
Degradation and breakdown characteristics of thin MgO dielectric layers R O’Connor, G Hughes, P Casey, SB Newcomb Journal of Applied Physics 107 (2), 2010 | 20 | 2010 |
Analysing trimethylaluminum infiltration into polymer brushes using a scalable area selective vapor phase process M Snelgrove, C McFeely, K Shiel, G Hughes, P Yadav, C Weiland, ... Materials Advances 2 (2), 769-781, 2021 | 19 | 2021 |
Hard x-ray photoelectron spectroscopy study of copper formation by metal salt inclusion in a polymer film M Snelgrove, PG Mani-González, J Bogan, R Lundy, JP Rueff, G Hughes, ... Journal of Physics D: Applied Physics 52 (43), 435301, 2019 | 19 | 2019 |
Reliability of HfSiON gate dielectrics R O'Connor, G Hughes, R Degraeve, B Kaczer, T Kauerauf Semiconductor science and technology 20 (1), 68, 2004 | 19 | 2004 |