| Effect of different pulse modes during Cl2/Ar inductively coupled plasma etching on the characteristics of nanoscale silicon trench formation HJ Kim, L Wen, D San Kim, KH Kim, JW Hong, WJ Chang, S Namgoong, ... Applied Surface Science 596, 153604, 2022 | 10 | 2022 |
| Radio frequency induction welding of silver nanowire networks for transparent heat films J Oh, L Wen, H Tak, H Kim, G Kim, J Hong, W Chang, D Kim, G Yeom Materials 14 (16), 4448, 2021 | 4 | 2021 |
| Effect of various pulse plasma techniques on TiO2 etching for metalens formation JW Hong, YH Kim, HJ Kim, HW Tak, KD Bae, JY Lee, HS Bae, YS Kim, ... Vacuum 212, 111978, 2023 | 3 | 2023 |
| Etched characteristics of nanoscale TiO2 using C4F8-based and BCl3-based gases JW Hong, YH Kim, HJ Kim, HW Tak, SN Goong, SB Kim, KD Bae, JY Lee, ... Materials Science in Semiconductor Processing 164, 107617, 2023 | 1 | 2023 |
| Indium tin oxide etch characteristics using CxH2x+ 2 (x= 1, 2, 3)/Ar JW Hong, HM Cho, YG Jeong, YJ Yeo, JE Kang, HJ Kim, HW Tak, ... Materials Science in Semiconductor Processing 160, 107395, 2023 | 1 | 2023 |
| Study on etch characteristics of magnetic tunnel junction materials using rf-biased H2/NH3 reactive ion beam YE Kim, DS Kim, YJ Jang, HS Gil, HS Jeon, JW Hong, IH Kim, C Kim, ... Journal of Vacuum Science & Technology A 41 (3), 2023 | 1 | 2023 |
| Reactive ion etching of indium gallium zinc oxide (IGZO) and chamber cleaning using low global warming potential gas JW Hong, HW Tak, NI Cho, HJ Eoh, CH Kim, JW Jeong, KL Kim, HJ Yoo, ... Applied Surface Science, 160692, 2024 | | 2024 |
| ATOMIC LAYER DEPOSITION DEVICE USING MULTIPLE PULSES TO FILL GAP OF SEMICONDUCTOR STRUCTURE WITH HIGH ASPECT RATIO AND ATOMIC LAYER DEPOSITION METHOD USING THE SAME GY Yeom, HG Kim, HW Tak, JW Hong, JE Kang US Patent App. 18/534,250, 2024 | | 2024 |
| Plasma etching method and plasma etching device GY Yeom, W Chang, HJ Kim, JE Kang, SNAM GOONG, JW Hong US Patent App. 18/370,444, 2024 | | 2024 |
| Meta-optical device and method of manufacturing metasurface J Lee, Y Geunyoung, KIM Heeju, J Hong, KIM Yeonhee, BAE Kideok, ... US Patent App. 17/724,861, 2023 | | 2023 |
| Etch Characteristics of Low-K Materials Using CF3I/C4F8/Ar/O2 Inductively Coupled Plasmas JW Hong, HW Tak, YH Choi, HJ Kim, DW Kim, GY Yeom Science of Advanced Materials 14 (7), 1258-1264, 2022 | | 2022 |
Geun-Young YeomSungkyunkwan University在 skku.edu 的电子邮件经过验证
Geun-Young YeomSungkyunkwan University在 skku.edu 的电子邮件经过验证