| Interface and reliability analysis of Au-passivated Cu–Cu fine-pitch thermocompression bonding for 3-D IC applications S Bonam, AK Panigrahi, CH Kumar, SRK Vanjari, SG Singh IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (7 …, 2019 | 49 | 2019 |
| Direct, CMOS in-line process flow compatible, sub 100 C Cu–Cu thermocompression bonding using stress engineering AK Panigrahi, T Ghosh, CH Kumar, SG Singh, SRK Vanjari Electronic Materials Letters 14, 328-335, 2018 | 21 | 2018 |
| Metal-alloy Cu surface passivation leads to high quality fine-pitch bump-less Cu-Cu bonding for 3D IC and heterogeneous integration applications AK Panigrahi, CH Kumar, S Bonam, PK Brince, T Ghosh, N Paul, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1561-1566, 2018 | 13 | 2018 |
| Optimized ultra-thin manganin alloy passivated fine-pitch damascene compatible bump-less Cu–Cu bonding at sub 200° C for three-dimensional Integration applications AK Panigrahi, CH Kumar, S Bonam, T Ghosh, SRK Vanjari, SG Singh Japanese Journal of Applied Physics 57 (2S1), 02BC04, 2017 | 12 | 2017 |
| Effect of ultrathin palladium layer in achieving a low temperature and pressure wafer level aluminum to aluminum bonding HK Cheemalamarri, S Bonam, SRK Vanjari, SG Singh Surface Topography: Metrology and Properties 8 (4), 045008, 2020 | 7 | 2020 |
| Noise performance improvement through optimized stacked layer of liner structure around the TSV in 3D IC CH Kumar, AK Panigrahi, OK Singh, SG Singh 2016 IEEE International 3D Systems Integration Conference (3DIC), 1-4, 2016 | 5 | 2016 |
| Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration S Patil, AK Panigrahi, S Bonam, CH Kumar, OK Singh, SG Singh 2016 IEEE International 3D Systems Integration Conference (3DIC), 1-4, 2016 | 5 | 2016 |
| Achieving of intensified conductive interconnections for Flex-on-Flex by using metal passivated Copper–Copper Thermocompression bonding CH Kumar, S Bonam, N Paul, SRK Vanjari, SG Singh 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1732-1737, 2018 | 4 | 2018 |
| CMOS-compatible fine pitch Al-Al bonding HK Cheemalamarri, B Varghese, S Jaibir, L Hongyu, CR SS, N Singh, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1725-1729, 2023 | 3 | 2023 |
| Fabrication of On-Silicon Aperture Coupled Patch Antenna Through Micromachining and Cu-Cu Thermocompression Bonding S Bonam, J Joseph, CH Kumar, AK Panigrahi, SRK Vanjari, SG Singh IEEE Transactions on Semiconductor Manufacturing 35 (4), 626-632, 2022 | 3 | 2022 |
| Ultrathin New Dielectric Interlayer Layer-Enhancer for TEOS-TEOS Bond Strength at Low Thermal Budget for C2W and W2W Bonding Applications HK Cheemalamarri, SLH Jang, JH Miao, V Nandini, CR BSS, CK Jien, ... 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 625-628, 2023 | 2 | 2023 |
| Diffusion Enhanced Optimized Thin Passivation Layer for Realizing Copper to Copper Wafer Bonding at Low Thermal Budget S Bonam, HK Cheemalamarri, SRK Vanjari, SG Singh 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 344-347, 2022 | 2 | 2022 |
| Ti/Si interface enabling complementary metal oxide semiconductor compatible, high reliable bonding for inter-die micro-fluidic cooling for future advanced 3D integrated circuit … HK Cheemalamarri, S Bonam, SRK Vanjari, SG Singh Journal of Micromechanics and Microengineering 30 (10), 105005, 2020 | 2 | 2020 |
| Gold Passivated Cu-Cu Bonding at 140 C For 3D IC Packaging and Heterogeneous Integration Applications S Bonam, CH Kumar, SRK Vanjari, SG Singh 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 547-550, 2018 | 2 | 2018 |
| High Density metal alloy Interconnections Using Novel Wafer Bonding Approach For 3D IC Packaging Applications CH Kumar, S Bonam, SRK Vanjari, SG Singh 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 625-628, 2018 | 1 | 2018 |
| Vanadium Pentoxide Nanofibers as IR sensors for Bolometer applications N Paul, S Vadnala, AK Panigrahi, CH Kumar, A Agrawal, SG Singh ECS Transactions 85 (13), 1573, 2018 | 1 | 2018 |
| Optimized ultra-thin Manganin alloy passivated fine-pitch damascene compatible Cu-Cu bonding at sub 200° C for 3D IC integration AK Panigrahi, CH Kumar, T Ghosh, SRK Vanjari, SG Singh 2017 5th International Workshop on Low Temperature Bonding for 3D …, 2017 | 1 | 2017 |
| Facile approach of enhanced heat mitigation between 3D stacked layers by Introducing a sub-micron thick heat spreading materials CH Kumar, AK Panigrahi, P Supraja, N Paul, SG Singh | 1 | 2017 |
| Dielectric Stack Optimization for Die-level Warpage Reduction for Chip-to-Wafer Hybrid Bonding BSSC Rao, MD Kumar, VN Sekhar, IC Daniel, SK Tippabhotla, SC Chong, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 62-68, 2024 | | 2024 |
| Cu/Dielectric hybrid bonding among Glass and Si HK Cheemalamarri, A Sundaram, TVN Anh, YJ Ok, VS Rao, N Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1543-1547, 2024 | | 2024 |
