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合著作者
Haobijam Johnson SinghPost Doctoral Researcher @ Tampere University在 tuni.fi 的电子邮件经过验证- Debayan DasguptaIndian Institute of Science, Bangalore在 iisc.ac.in 的电子邮件经过验证
- Arijit GhoshProcess development engineer, Lithography, Intel Corporation在 intel.com 的电子邮件经过验证
- Deepak SainiIndian Institute of Science在 iisc.ac.in 的电子邮件经过验证
- Pooyath Lekshmy VenugopalanFulbright Fellow, Department of Nanoengineering, University of California, San Diego在 eng.ucsd.edu 的电子邮件经过验证
- Debadrita PariaPostdoctoral Researcher, Johns Hopkins University在 jhu.edu 的电子邮件经过验证
- Souvik GhoshResearch Associate at University of Colorado Boulder在 colorado.edu 的电子邮件经过验证
- Vaisakh VadakkumbattUniversity of Alberta在 ualberta.ca 的电子邮件经过验证
- Pranay MandalMax-Planck Institute of Molecular Cell Biology and Genetics在 mpi-cbg.de 的电子邮件经过验证
- Malay PalPhD student, Indian Institute of Science, Bangalore在 iisc.ac.in 的电子邮件经过验证
- Preeti DeshpandeCenter for Nanoscience, IISc在 cense.iisc.ernet.in 的电子邮件经过验证
- Emil Mathew JosephIndian Institute of Science在 iisc.ac.in 的电子邮件经过验证
- Neha YadavUC Berkeley在 berkeley.edu 的电子邮件经过验证
- Kallol RoyResearch Fellow, NUS, Singapore在 nus.edu.sg 的电子邮件经过验证
- Bikramjit BasuProfessor, Materials Research Center, Indian Institute of Science, Bangalore, INDIA; Other在 iisc.ac.in 的电子邮件经过验证
- Ranajit SaiTyndall National Institute在 ieee.org 的电子邮件经过验证
- Yashoda ChandorkarEmpa Swiss Federal Laboratories for Materials Science and Technology/ ETHZ Domain在 empa.ch 的电子邮件经过验证
- Alex LeshanskyDepartment of Chemical Engineering, Technion-IIT在 technion.ac.il 的电子邮件经过验证
- Shishir KumarAssistant Professor, Department of Electrical Engineering, Indian Institute of Technology, Hyderabad在 iith.ac.in 的电子邮件经过验证
- Sandeep M. EswarappaDepartment of Biochemistry, Indian Institute of Science, Bangalore 560012, India在 iisc.ac.in 的电子邮件经过验证
