| Exploiting Memristive BiFeO3 Bilayer Structures for Compact Sequential Logics T You, Y Shuai, W Luo, N Du, D Bürger, I Skorupa, R Hübner, S Henker, ... Advanced Functional Materials 24 (22), 3357-3365, 2014 | 150 | 2014 |
| Bipolar Electric-Field Enhanced Trapping and Detrapping of Mobile Donors in BiFeO3 Memristors T You, N Du, S Slesazeck, T Mikolajick, G Li, D Bürger, I Skorupa, ... ACS applied materials & interfaces 6 (22), 19758-19765, 2014 | 95 | 2014 |
| Thermal Transport across Ion-Cut Monocrystalline β-Ga2O3 Thin Films and Bonded β-Ga2O3–SiC Interfaces Z Cheng, F Mu, T You, W Xu, J Shi, ME Liao, Y Wang, K Huynh, T Suga, ... ACS Applied Materials & Interfaces 12 (40), 44943-44951, 2020 | 86 | 2020 |
| Recent progress of integrated circuits and optoelectronic chips Y Hao, S Xiang, G Han, J Zhang, X Ma, Z Zhu, X Guo, Y Zhang, Y Han, ... Science China Information Sciences 64 (10), 201401, 2021 | 82 | 2021 |
| First Demonstration of Waferscale Heterogeneous Integration of Ga2O3 MOSFETs on SiC and Si Substrates by Ion-Cutting Process W Xu, Y Wang, T You, X Ou, G Han, H Hu, S Zhang, F Mu, T Suga, ... 2019 IEEE International Electron Devices Meeting (IEDM), 12.5. 1-12.5. 4, 2019 | 71 | 2019 |
| High-quality factor, high-confinement microring resonators in 4H-silicon carbide-on-insulator Y Zheng, M Pu, A Yi, B Chang, T You, K Huang, AN Kamel, MR Henriksen, ... Optics express 27 (9), 13053-13060, 2019 | 68 | 2019 |
| Single pairing spike-timing dependent plasticity in BiFeO3 memristors with a time window of 25 ms to 125 μs N Du, M Kiani, CG Mayr, T You, D Bürger, I Skorupa, OG Schmidt, ... Frontiers in neuroscience 9, 227, 2015 | 66 | 2015 |
| Wafer-scale 4H-silicon carbide-on-insulator (4H–SiCOI) platform for nonlinear integrated optical devices A Yi, Y Zheng, H Huang, J Lin, Y Yan, T You, K Huang, S Zhang, C Shen, ... Optical Materials 107, 109990, 2020 | 52 | 2020 |
| Silicon carbide for integrated photonics A Yi, C Wang, L Zhou, Y Zhu, S Zhang, T You, J Zhang, X Ou Applied Physics Reviews 9 (3), 2022 | 50 | 2022 |
| Wafer-Scale Fabrication of 42° Rotated Y-Cut LiTaO3-on-Insulator (LTOI) Substrate for a SAW Resonator Y Yan, K Huang, H Zhou, X Zhao, W Li, Z Li, A Yi, H Huang, J Lin, ... ACS Applied Electronic Materials 1 (8), 1660-1666, 2019 | 50 | 2019 |
| Field-driven hopping transport of oxygen vacancies in memristive oxide switches with interface-mediated resistive switching N Du, N Manjunath, Y Li, S Menzel, E Linn, R Waser, T You, D Bürger, ... Physical review applied 10 (5), 054025, 2018 | 47 | 2018 |
| β-Ga2O3 MOSFETs on the Si substrate fabricated by the ion-cutting process YB Wang, WH Xu, TG You, FW Mu, HD Hu, Y Liu, H Huang, T Suga, ... Science China Physics, Mechanics & Astronomy 63 (7), 277311, 2020 | 43 | 2020 |
| Engineering interface-type resistive switching in BiFeO3 thin film switches by Ti implantation of bottom electrodes T You, X Ou, G Niu, F Bärwolf, G Li, N Du, D Bürger, I Skorupa, Q Jia, ... Scientific reports 5, 18623, 2015 | 42 | 2015 |
| Fabrication and optical properties of needle-like ZnO array by a simple hydrothermal process T You, J Yan, Z Zhang, J Li, J Tian, J Yun, W Zhao Materials letters 66 (1), 246-249, 2012 | 41 | 2012 |
| Surface wave and Lamb wave acoustic devices on heterogenous substrate for 5G front-ends H Zhou, S Zhang, Z Li, K Huang, P Zheng, J Wu, C Shen, L Zhang, T You, ... 2020 IEEE International Electron Devices Meeting (IEDM), 17.6. 1-17.6. 4, 2020 | 40 | 2020 |
| Realization of wafer-scale nanogratings with sub-50 nm period through vacancy epitaxy Q Huang, Q Jia, J Feng, H Huang, X Yang, J Grenzer, K Huang, S Zhang, ... Nature Communications 10 (1), 2437, 2019 | 36 | 2019 |
| Efficient ion-slicing of InP thin film for Si-based hetero-integration J Lin, T You, M Wang, K Huang, S Zhang, Q Jia, M Zhou, W Yu, S Zhou, ... Nanotechnology 29 (50), 504002, 2018 | 29 | 2018 |
| 3D Local Manipulation of the Metal–Insulator Transition Behavior in VO2 Thin Film by Defect‐Induced Lattice Engineering Q Jia, J Grenzer, H He, W Anwand, Y Ji, Y Yuan, K Huang, T You, W Yu, ... Advanced Materials Interfaces 5 (8), 1701268, 2018 | 27 | 2018 |
| Thermal visualization of buried interfaces enabled by ratio signal and steady-state heating of time-domain thermoreflectance Z Cheng, F Mu, X Ji, T You, W Xu, T Suga, X Ou, DG Cahill, S Graham ACS Applied Materials & Interfaces 13 (27), 31843-31851, 2021 | 24 | 2021 |
| Efficient thermal dissipation in wafer-scale heterogeneous integration of single-crystalline β-Ga2O3 thin film on SiC W Xu, T You, Y Wang, Z Shen, K Liu, L Zhang, H Sun, R Qian, Z An, F Mu, ... Fundamental Research 1 (6), 691-696, 2021 | 23 | 2021 |
Xin OuShanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences在 mail.sim.ac.cn 的电子邮件经过验证
