| Microassembly of heterogeneous materials using transfer printing and thermal processing H Keum, Z Yang, K Han, DE Handler, TN Nguyen, J Schutt-Aine, G Bahl, ... Scientific reports 6 (1), 29925, 2016 | 41 | 2016 |
| Transient simulation for high-speed channels with recurrent neural network T Nguyen, T Lu, J Sun, Q Le, K We, J Schut-Aine 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 30 | 2018 |
| Comparative Study of Surrogate Modeling Methods for Signal Integrity and Microwave Circuit Applications T Nguyen, B Shi, H Ma, EP Li, X Chen, AC Cangellaris, J Schutt-Ainé IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 24 | 2021 |
| Fast transient simulation of high-speed channels using recurrent neural network T Nguyen, T Lu, K Wu, J Schutt-Aine arXiv preprint arXiv:1902.02627, 2019 | 15 | 2019 |
| A deep learning approach for volterra kernel extraction for time domain simulation of weakly nonlinear circuits T Nguyen, X Wang, X Chen, J Schutt-Aine 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1889-1896, 2019 | 10 | 2019 |
| Gaussian Process surrogate model for variability analysis of RF circuits T Nguyen, J Schutt-Aine 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 8 | 2020 |
| Laguerre–Volterra Feed-Forward Neural Network for Modeling PAM-4 High-Speed Links X Wang, T Nguyen, JE Schutt-Ainé IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 8 | 2020 |
| A Tunable Neural Network based Decision Feed-back Equalizer model for High-speed Link Simulation T Nguyen, J Schutt-Aine 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020 | 6 | 2020 |
| A pseudo-supervised machine learning approach to broadband LTI macro-modeling T Nguyen, JE Schutt-Aine 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 …, 2018 | 6 | 2018 |
| Modular Neural Network-Based Models of High-Speed Link Transceivers Y Zhao, T Nguyen, H Ma, EP Li, AC Cangellaris, JE Schutt-Ainé IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 4 | 2023 |
| Variational Inference approach to Jitter decomposition in High-speed Link B Shi, T Nguyen, J Schutt-Aine 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020 | 4 | 2020 |
| PAM-4 Behavioral Modeling using Machine Learning via Laguerre-Volterra Expansion X Wang, T Nguyen, JE Schutt-Aine 2020 IEEE 11th Latin American Symposium on Circuits & Systems (LASCAS), 1-4, 2020 | 3 | 2020 |
| Volterra kernel extraction through monomial power series feed forward neural network for behavior modeling of high speed i/o buffer X Wang, T Nguyen, J Schutt-Aine 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo …, 2019 | 3 | 2019 |
| Volterra kernels extraction from frequency-domain data for weakly non-linear circuit time-domain simulation T Nguyen, JE Schutt-Aine, Y Chen 2017 IEEE Radio and Antenna Days of the Indian Ocean (RADIO), 1-2, 2017 | 3 | 2017 |
| Statistical Method for Eye Diagram Simulation in a High-Speed Link Nonlinear System B Shi, Y Zhou, T Nguyen, J Schutt-Aine 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2022 | 2 | 2022 |
| Application of Neural Network Based Cascade-able Transceiver Model in Serial Link Simulation Y Zhao, T Nguyen, JE Schutt-Ainé 2022 IEEE 26th Workshop on Signal and Power Integrity (SPI), 1-2, 2022 | 2 | 2022 |
| Comparative study of Machine Learning methods for variability analysis in High-speed link T Nguyen, B Shi, J Schutt-Aine 2021 IEEE 25th Workshop on Signal and Power Integrity (SPI), 1-3, 2021 | 2 | 2021 |
| Modeling Cascade-able Transceiver Blocks With Neural Network For High Speed Link Simulation Y Zhao, T Nguyen, H Ma, EP Li, A Cangellaris, JE Schutt-Ainé 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2022 | 1 | 2022 |
| A Methodology to Optimize the Number and Placement of Decoupling Capacitors in a Multilevel Power Delivery Network R Krishna, T Nguyen, AO Watanabe, D Becker, A Kumar, E Rosenbaum 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2022 | 1 | 2022 |
| Decision Feedback Equalizer (DFE) Taps Estimation with Machine Learning Methods B Shi, Y Zhao, H Ma, T Nguyen, EP Li, AC Cangellaris, J Schutt-Aine 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2021 | 1 | 2021 |
