| A numerical study on slurry flow with CMP pad grooves S Hong, S Bae, S Choi, P Liu, H Kim, T Kim Microelectronic Engineering 234, 111437, 2020 | 8 | 2020 |
| AYDIN et al. K Aydin, S Woo, VK Kanade, S Choi, C Ahn, B Lim, T Kim Carbon Energy 5 (11), 2023 | 7 | 2023 |
| A study of highly activated hydrogen evolution reaction performance in acidic media by 2D heterostructure of N and S doped graphene on MoOx K Aydin, S Woo, VK Kanade, S Choi, C Ahn, B Lim, T Kim Carbon Energy 5 (11), e340, 2023 | 4 | 2023 |
| Quadrature moment simulation of silica nanoparticles aggregation and breakage in chemical mechanical polishing S Choi, G Im, E Kim, K Park, T Kim Journal of Industrial and Engineering Chemistry 107, 207-214, 2022 | 4 | 2022 |
| Uniform deposition method of monodispersed SiO2 nanoparticles on a 300-mm Si wafer surface S Lee, S Choi, Y Cho, H Oh, SK Chae, T Kim Review of Scientific Instruments 92 (11), 2021 | 2 | 2021 |
| QMOM 접근법에 의한 CMP 의 실리카 나노 입자 응집 시뮬레이션 최슬기， 류펑잔， 김태성 대한기계학회 춘추학술대회, 320-321, 2021 | | 2021 |
Taesung KimSungkyunkwan University在 skku.edu 的电子邮件经过验证
