| Real-time conversion of sensor array signals into spherical harmonic signals with applications to spatially localized sub-band sound-field analysis L McCormack, S Delikaris-Manias, A Farina, D Pinardi, V Pulkki Audio Engineering Society Convention 144, 2018 | 33 | 2018 |
| Applications of spatially localized active-intensity vectors for sound-field visualization L McCormack, S Delikaris-Manias, A Politis, D Pavlidi, A Farina, D Pinardi, ... Journal of the Audio Engineering Society 67 (11), 840-854, 2019 | 24 | 2019 |
| Individualized HRTF for playing VR videos with Ambisonics spatial audio on HMDs M Binelli, D Pinardi, T Nili, A Farina Audio Engineering Society Conference: 2018 AES International Conference on …, 2018 | 21 | 2018 |
| Measurement of loudspeakers with a laser doppler vibrometer and the exponential sine sweep excitation technique MC Bellini, L Collini, A Farina, D Pinardi, K Riabova Journal of the Audio Engineering Society 65 (7/8), 600-612, 2017 | 15 | 2017 |
| An innovative architecture of full-digital microphone arrays over A²B network for consumer electronics D Pinardi, N Rocchi, A Toscani, M Binelli, G Chiorboli, A Farina, L Cattani IEEE Transactions on Consumer Electronics 68 (3), 200-208, 2022 | 14 | 2022 |
| Metrics for evaluating the spatial accuracy of microphone arrays D Pinardi, A Farina 2021 Immersive and 3D Audio: from Architecture to Automotive (I3DA), 1-9, 2021 | 14 | 2021 |
| Virtual reality for subjective assessment of sound quality in cars A Farina, D Pinardi, M Binelli, M Ebri, L Ebri Audio Engineering Society Convention 144, 2018 | 13 | 2018 |
| Spherical t-design for characterizing the spatial response of microphone arrays D Pinardi 2021 Immersive and 3D Audio: from Architecture to Automotive (I3DA), 1-8, 2021 | 12 | 2021 |
| Transducer Arrays Over A²B Networks in Industrial and Automotive Applications: Clock Propagation Measurements N Rocchi, A Toscani, G Chiorboli, D Pinardi, M Binelli, A Farina IEEE Access 9, 118232-118241, 2021 | 12 | 2021 |
| Geometrical Acoustics Simulations for Ambisonics Auralization of a Car Sound System at High Frequency D Pinardi, K Riabova, M Binelli, A Farina, JS Park 2021 Immersive and 3D Audio: from Architecture to Automotive (I3DA), 1-10, 2021 | 11 | 2021 |
| A Modular, Low Latency, A2B-based Architecture for Distributed Multichannel Full-Digital Audio Systems N Rocchi, A Toscani, D Pinardi, M Binelli, L Chiesi, A Farina, E Bonomi, ... 2021 Immersive and 3D Audio: from Architecture to Automotive (I3DA), 1-8, 2021 | 11 | 2021 |
| Direction specific analysis of psychoacoustics parameters inside car cockpit: A novel tool for NVH and sound quality D Pinardi, L Ebri, C Belicchi, A Farina, M Binelli SAE Technical Paper, 2020 | 8 | 2020 |
| ANC: A low-cost implementation perspective C Belicchi, A Opinto, M Martalo, A Tira, D Pinardi, A Farina, G Ferrari SAE Technical Paper 1, 1-8, 2022 | 7 | 2022 |
| Application of laser vibrometer for the study of loudspeaker dynamics L Collini, A Farina, R Garziera, D Pinardi, K Riabova Materials Today: Proceedings 4 (5), 5773-5778, 2017 | 7 | 2017 |
| A human head shaped array of microphones and cameras for automotive applications D Pinardi 2021 Immersive and 3D Audio: from Architecture to Automotive (I3DA), 1-8, 2021 | 6 | 2021 |
| Low-cost structural health monitoring system for smart buildings A Toscani, N Rocchi, D Pinardi, M Binelli, L Saccenti, A Farina, S Pavoni, ... 2022 Second International Conference on Sustainable Mobility Applications …, 2022 | 5 | 2022 |
| Low-Cost Condition Monitoring System for Smart Buildings and Industrial Applications A Toscani, N Rocchi, D Pinardi, M Binelli, L Saccenti, A Farina, S Pavoni, ... IEEE Transactions on Industry Applications, 2023 | 4 | 2023 |
| Spherical wave diffraction for microphone arrays operating in near field D Pinardi 2023 Immersive and 3D Audio: from Architecture to Automotive (I3DA), 1-5, 2023 | 4 | 2023 |
| A Novel Scalable Digital Data Acquisition System for Industrial Condition Monitoring A Toscani, F Immovilli, D Pinardi, L Cattani IEEE Transactions on Industrial Electronics, 2023 | 4 | 2023 |
| Full-Digital Microphone Meta-Arrays for Consumer Electronics D Pinardi, A Toscani, M Binelli, L Saccenti, A Farina, L Cattani IEEE Transactions on Consumer Electronics 69 (3), 640-648, 2023 | 4 | 2023 |
Angelo FarinaUniversity of Parma在 unipr.it 的电子邮件经过验证
