| Low cost, large area, flexible graphene nanocomposite films for energy harvesting applications M Kandpal, V Palaparthy, N Tiwary, VR Rao IEEE Transactions on Nanotechnology 16 (2), 259-264, 2017 | 15 | 2017 |
| Fabrication, characterization and application of ZnO nanostructure-based micro-preconcentrator for TNT sensing N Tiwary, M Vinchurkar, M Patel, R Nathawat, S Pandey, VR Rao Journal of Microelectromechanical Systems 25 (5), 968-975, 2016 | 11 | 2016 |
| Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150° C O Golim, V Vuorinen, G Ross, T Wernicke, M Pawlak, N Tiwary, ... Scripta Materialia 222, 114998, 2023 | 10 | 2023 |
| Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs N Tiwary, G Ross, V Vuorinen, M Paulasto-Kröckel IEEE Transactions on Electron Devices, 2022 | 10 | 2022 |
| Spin-coatable, photopatternable magnetic nanocomposite thin films for MEMS device applications M Kandpal, C Sharan, V Palaparthy, N Tiwary, P Poddar, VR Rao RSC advances 5 (104), 85741-85747, 2015 | 8 | 2015 |
| Finite element simulation of solid-liquid interdiffusion bonding process: Understanding process dependent thermomechanical stress N Tiwary, V Vuorinen, G Ross, M Paulasto-Kröckel IEEE Transactions on Components, Packaging and Manufacturing Technology, 2022 | 7 | 2022 |
| Piezoresponse force microscopy (PFM) characterization of GaN nanowires grown by Plasma assisted Molecular beam epitaxy (PA-MBE) N Tiwary, R Sarkar, VR Rao, A Laha 2016 Joint IEEE International Symposium on the Applications of …, 2016 | 7 | 2016 |
| Investigation of seal frame geometry on Sn squeeze-out in Cu-Sn SLID bonds P Papatzacos, N Tiwary, N Hoivik, HV Nguyen, A Roy, KE Aasmundtveit 2021 23rd European Microelectronics and Packaging Conference & Exhibition …, 2021 | 6 | 2021 |
| Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding F Emadi, S Liu, A Klami, N Tiwary, V Vuorinen, M Paulasto-Kröckel 2022 14th International Conference on Advanced Semiconductor Devices and …, 2022 | 4 | 2022 |
| Low-temperature Metal Bonding for Optical Device Packaging O Golim, V Vuorinen, N Tiwary, R Glenn, M Paulasto-Kröckel 2021 23rd European Microelectronics and Packaging Conference & Exhibition …, 2021 | 4 | 2021 |
| Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope T Nieminen, N Tiwary, G Ross, M Paulasto-Kröckel Micromachines 14 (3), 698, 2023 | 2 | 2023 |
| Critical analysis of micro-thermogravimetry of CuSO4· 5H2O crystals using heatable microcantilevers N Tiwary, M Zakerin, F Natalio, E Biegler, F Marco, H Kaubitzsch, A Laha, ... Journal of Micromechanics and Microengineering 29 (10), 105009, 2019 | 1 | 2019 |
| Experimental and theoretical analyses of effect of ZnO nanowire growth on mechanical properties of microcantilevers for dynamic sensing applications N Tiwary, A Kushagra, M Kandpal, VR Rao 2016 IEEE SENSORS, 1-3, 2016 | 1 | 2016 |
| Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test S Liu, V Vuorinen, X Liu, O Fredrikson, S Brand, N Tiwary, J Lutz, ... IEEE Transactions on Power Electronics, 2024 | | 2024 |
| Finite element simulation of solid-liquid interdiffusion bonding process N Tiwary, V Vuorinen, G Ross, M Paulasto-Krockel IEEE, 2022 | | 2022 |
| Enhancing the sensitivity of MEMS Thermogravimetry and Micropreconcentrator platforms for Chemical/Gas detection N Tiwary Indian Institute of Technology Bombay, 2019 | | 2019 |
| Polarity imaging of GaN nanowires grown by Plasma Assisted-Molecular Beam Epitaxy on various substrates at different growth conditions N Tiwary, R Sarkar, K Ghosh, V Ramgopal Rao, A Laha 12th International conference on Nitride Semiconductors (ICNS12), Jul 24th …, 2017 | | 2017 |
Vesa VuorinenAalto University在 tkk.fi 的电子邮件经过验证
